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TMS320C6727BZDH300

Texas Instruments

TMS320C6727BZDH300 by Texas Instruments

TMS320C6727BZDH300 by Texas Instruments is a 32-bit DSP with integrated cache and 262144 RAM words. It operates at up to 25 MHz, suitable for digital signal processing applications. The package style is grid array, with a terminal pitch of 1 mm and a max seated height of 2.02 mm.

Median Price

$38.984

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Texas Instruments

USA . 27,511 parts In-Stock

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$31.458

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DigiKey

USA . 63 parts In-Stock

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$46.510

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Digiode

USA . 1,926 parts In-Stock

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$29.885

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Chip Stock

USA . 7,309 parts In-Stock

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Vyrian

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Bristol Electronics

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Atlantic Semiconductor

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Corphita

USA . 1,885 parts In-Stock

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$28.312

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Corohmni

South Africa . 65 parts In-Stock

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$32.522

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Parana Technologies

USA . 1,837 parts In-Stock

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$59.459

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ChromeModa Solutions

Germany . 1,283 parts In-Stock

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$66.808

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$54.783

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IDEA Electronic Components Group

UK . 1,149 parts In-Stock

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$63.468

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$60.127

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Lixinc

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DigiPath Technology Company

USA . 2,374 parts In-Stock

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Kepictronics

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Benley Electronics

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GreenTree Electronics

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Computer Components Inc. - USA

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Overview

Experience the power of cutting-edge technology with the TMS320C6727BZDH300 by Texas Instruments. This Digital Signal Processor offers unparalleled performance and reliability, showcasing the exceptional quality that TI is known for. Ideal for a wide range of applications, this DSP provides seamless integration and efficient processing, delivering value and benefits to customers looking for top-of-the-line solutions. Unlock the potential of your projects with the TMS320C6727BZDH300 and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, making it suitable for various environments.

Integrated Cache: YES

Having integrated cache improves data access speed and efficiency, enhancing overall performance.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage allows for optimal power utilization and performance capabilities.

Address Bus Width: 32

With a wide address bus width, the DSP can handle large memory address spaces efficiently.

Bit Size: 32

A 32-bit architecture enables the processor to handle complex calculations and data processing tasks effectively.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures reliability and stability in various operating conditions.

No. of Terminals: 256

Having a high number of terminals allows for versatile connectivity options and integration with other components.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This specific type of peripheral IC is designed for efficient digital signal processing tasks, making it a suitable choice for specialized applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6727BZDH300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of Terminals:

256

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

ROM Programmability:

MROM

Maximum Seated Height:

2.02 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6727BZDH300 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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