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TMS320C6726RFPA225

Texas Instruments

TMS320C6726RFPA225 by Texas Instruments

TMS320C6726RFPA225 by Texas Instruments is a 32-bit DSP with 262144 RAM words, operating at max 25 MHz clock frequency. Ideal for digital signal processing applications due to its 32-bit data bus width and floating-point format support. Package style includes flatpack, heat sink/slug, thin profile options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,869 parts In-Stock

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3,869

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Digiode

USA . 669 parts In-Stock

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669

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Distributors (Availability)

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AZTECH Wire

Italy . 309 parts In-Stock

1+ parts

$19.879

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309

$19.879

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One Stop Electronics

USA . 918 parts In-Stock

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$22.000

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918

$22.000

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Corohmni

South Africa . 3,131 parts In-Stock

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$49.611

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$49.611

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Parana Technologies

USA . 2,176 parts In-Stock

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$76.355

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2,176

$76.355

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DigiPath Technology Company

USA . 1,344 parts In-Stock

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$84.076

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1,344

$84.076

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ChromeModa Solutions

Germany . 2,214 parts In-Stock

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$85.792

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$70.349

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2,214

$85.792

$70.349

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IDEA Electronic Components Group

UK . 234 parts In-Stock

1+ parts

$85.792

100+ parts

$81.502

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$77.213

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234

$85.792

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$77.213

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Corphita

USA . 3,511 parts In-Stock

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3,511

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Microchip USA

USA . 478 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS320C6726RFPA225 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-quality products that set the standard for performance and efficiency. Ideal for a wide range of applications, this DSP offers unparalleled value and benefits to customers seeking high-speed processing capabilities and reliable performance. Elevate your projects with the TMS320C6726RFPA225 and unlock endless possibilities in the world of digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for electronic devices that need to be portable and withstand daily use.

Surface Mount: YES

Surface mount technology allows for easier and more cost-effective assembly of the DSPs onto circuit boards, saving time and resources during production.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage of 1.32V ensures stable and reliable operation of the DSP under various operating conditions.

Package Shape: SQUARE

The square package shape provides a compact form factor, optimizing space efficiency and allowing for easier integration into electronic systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a DSP, this product is specifically designed for processing digital signals with high efficiency and accuracy, making it a suitable choice for applications requiring signal processing capabilities.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz enables fast processing speeds and real-time performance, making this DSP suitable for time-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6726RFPA225 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

144

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320C6726RFPA225 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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