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TMS320C6678AXCYP25

Texas Instruments

TMS320C6678AXCYP25 by Texas Instruments

TMS320C6678AXCYP25 by Texas Instruments is a 32-bit DSP with integrated cache, 16-bit external data bus width, and 80 DMA channels. It is used in digital signal processing applications requiring low power mode and floating-point format calculations.

Median Price

$376.278

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 218 parts In-Stock

1+ parts

$279.905

100+ parts

$253.362

1k+ parts

$241.297

10k+ parts

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218

$279.905

$253.362

$241.297

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Mouser Electronics

USA . 2 parts In-Stock

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$472.650

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2

$472.650

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$237.725

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300

$237.725

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Digiode

USA . 1,933 parts In-Stock

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$265.910

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1,933

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Vyrian

USA . 8,597 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 550 parts In-Stock

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$19.379

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550

$19.379

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Parana Technologies

USA . 181 parts In-Stock

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$27.888

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$41.250

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181

$27.888

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$41.250

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ChromeModa Solutions

Germany . 2,698 parts In-Stock

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$31.335

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$25.695

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2,698

$31.335

$25.695

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IDEA Electronic Components Group

UK . 108 parts In-Stock

1+ parts

$31.335

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$29.768

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$28.202

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108

$31.335

$29.768

$28.202

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Corohmni

South Africa . 310 parts In-Stock

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$39.633

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Netroflash

USA . 2,000 parts In-Stock

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$237.725

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$237.725

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Continental Prestige Electronics

USA . 1,864 parts In-Stock

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$237.725

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$232.971

1,864

$237.725

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$232.971

Ampacity Inc.

Singapore . 110 parts In-Stock

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$237.920

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$237.920

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Corphita

USA . 1,479 parts In-Stock

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$251.914

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$251.914

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Microchip USA

USA . 1,797 parts In-Stock

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$405.378

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DigiPath Technology Company

USA . 1,747 parts In-Stock

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$28.252

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1,747

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$28.252

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Argo Parts USA

USA . 1,612 parts In-Stock

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Perfect Parts

USA . 49 parts In-Stock

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Kepictronics

USA . 45 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments TMS320C6678AXCYP25 Digital Signal Processor. As a leader in semiconductor manufacturing, Texas Instruments ensures superior quality and reliability in every product. Ideal for a wide range of applications, this DSP offers unparalleled performance and efficiency. Experience seamless operation and enhanced functionality with the TMS320C6678AXCYP25, providing you with the value and benefits you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic material ensures durability and protection for the internal components of the DSP, making it a reliable choice for long-term use.

Integrated Cache: YES

Integrated cache helps in faster data access and processing, improving overall performance of the DSP.

Address Bus Width: 24

A wider address bus allows the DSP to handle larger amounts of data efficiently, enhancing its processing capabilities.

Bit Size: 32

32-bit architecture enables the DSP to perform complex mathematical operations with high precision, making it suitable for a wide range of applications.

Power Supplies (V): 1, 1.5, 1.8

Ability to operate at multiple voltage levels provides flexibility in power requirements, making it compatible with different system configurations.

RAM Words: 8192

Large RAM capacity allows the DSP to store and manipulate a significant amount of data, enhancing its processing capabilities.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a dedicated digital signal processor, this product is designed specifically for efficient signal processing tasks, offering superior performance compared to generic processors.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation, making this DSP energy-efficient and suitable for battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6678AXCYP25 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

80

No. of Terminals:

841

No. of Timers:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6678AXCYP25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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