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TMS320C6678AXCYP

Texas Instruments

TMS320C6678AXCYP by Texas Instruments

TMS320C6678AXCYP by Texas Instruments is a 32-bit DSP with integrated cache, 16-bit external data bus width, and 80 DMA channels. Ideal for digital signal processing applications requiring low power mode, it features a grid array package style and operates b/w 0-85°C temperature range.

Median Price

$228.104

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$228.104

100+ parts

-

1k+ parts

-

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10

$228.104

-

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Digiode

USA . 2,971 parts In-Stock

1+ parts

-

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-

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2,971

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Vyrian

USA . 290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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290

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 325 parts In-Stock

1+ parts

$5.596

100+ parts

-

1k+ parts

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10k+ parts

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325

$5.596

-

-

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Ampacity Inc.

Singapore . 228 parts In-Stock

1+ parts

$14.000

100+ parts

-

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228

$14.000

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One Stop Electronics

USA . 1,136 parts In-Stock

1+ parts

$18.000

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1,136

$18.000

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Parana Technologies

USA . 2,235 parts In-Stock

1+ parts

$29.447

100+ parts

-

1k+ parts

$59.463

10k+ parts

-

2,235

$29.447

-

$59.463

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ChromeModa Solutions

Germany . 6,080 parts In-Stock

1+ parts

$33.087

100+ parts

$27.131

1k+ parts

-

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6,080

$33.087

$27.131

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IDEA Electronic Components Group

UK . 2,378 parts In-Stock

1+ parts

$33.087

100+ parts

$31.433

1k+ parts

$29.778

10k+ parts

-

2,378

$33.087

$31.433

$29.778

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Corohmni

South Africa . 2,544 parts In-Stock

1+ parts

$83.164

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2,544

$83.164

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Microchip USA

USA . 2,230 parts In-Stock

1+ parts

$222.650

100+ parts

$216.710

1k+ parts

$213.740

10k+ parts

$210.770

2,230

$222.650

$216.710

$213.740

$210.770

Continental Prestige Electronics

USA . 1,636 parts In-Stock

1+ parts

$228.104

100+ parts

-

1k+ parts

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10k+ parts

$223.542

1,636

$228.104

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-

$223.542

Netroflash

USA . 500 parts In-Stock

1+ parts

$228.104

100+ parts

-

1k+ parts

$216.698

10k+ parts

$212.136

500

$228.104

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$216.698

$212.136

Corphita

USA . 3,434 parts In-Stock

1+ parts

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3,434

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Argo Parts USA

USA . 1,035 parts In-Stock

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1,035

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DigiPath Technology Company

USA . 64 parts In-Stock

1+ parts

-

100+ parts

$29.831

1k+ parts

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10k+ parts

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64

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$29.831

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Overview

Experience the power of cutting-edge technology with the TMS320C6678AXCYP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a top-of-the-line digital signal processor that offers unparalleled performance and reliability. Ideal for a wide range of applications, this DSP is designed to enhance efficiency and optimize functionality. Unlock the full potential of your projects with the TMS320C6678AXCYP and stay ahead of the curve in today's competitive market. Elevate your work with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the DSP, making it suitable for a variety of applications.

Integrated Cache: YES

Improves processing speed and efficiency by storing frequently accessed data for quick retrieval.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and making assembly more efficient.

Address Bus Width: 24

Enables the DSP to access a larger memory address space, allowing for more complex algorithms and data manipulation.

Bit Size: 32

Offers high processing power and precision for handling digital signal processing tasks effectively.

Power Supplies (V): 1, 1.5, 1.8

Provides flexibility in power options, allowing the DSP to be used in a variety of voltage environments.

No. of Terminals: 841

Offers a high number of connection points for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enables a compact design and efficient signal routing, improving overall performance and reliability.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Maintains performance in low-temperature conditions, ensuring versatility in various operating environments.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for reliable connections and long-term durability.

Terminal Position: BOTTOM

Facilitates easy PCB mounting and soldering, enhancing the assembly process.

Maximum Seated Height: 3.39 mm

Maintains a low profile for space-constrained applications and efficient airflow in compact electronic designs.

RAM Words: 8192

Offers ample memory for storing and manipulating data, enabling complex signal processing algorithms to be executed efficiently.

Width: 24 mm

Compact form factor allows for integration into tight spaces without sacrificing performance.

Boundary Scan: YES

Facilitates testing and debugging of the DSP during production, ensuring high quality and reliability.

External Data Bus Width: 16

Efficient data transfer between the DSP and external memory or peripherals, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and component mounting during assembly, improving product reliability.

Peak Reflow Temperature °C: 245

Withstands high-temperature soldering processes for reliable and durable connections.

Internal Bus Architecture: MULTIPLE

Enhances data processing speed and efficiency by enabling parallel data transfer within the DSP.

Length: 24 mm

Compact size allows for easy integration into various electronic devices and systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Provides versatile interfacing capabilities and compatibility, enhancing the DSP's functionality.

No. of Timers: 16

Enables precise timing and synchronization of tasks, essential for applications requiring time-sensitive operations.

Technology: CMOS

Low power consumption and high noise immunity for efficient and reliable signal processing applications.

Terminal Form: BALL

Facilitates reliable connections and efficient soldering, ensuring long-term performance and durability.

No. of DMA Channels: 80

Offers high-speed data transfer capabilities, essential for handling large volumes of data in real-time signal processing tasks.

Terminal Pitch: 0.8 mm

Fine pitch spacing allows for high-density mounting on PCBs, optimizing space utilization in electronic designs.

Format: FLOATING POINT

Enables efficient processing of real-world data with decimal points, essential for diverse signal processing applications.

Moisture Sensitivity Level (MSL): 4

Withstands exposure to moisture during manufacturing and operation, ensuring long-term reliability in various environments.

Low Power Mode: YES

Enables power-saving operation when high performance is not required, improving energy efficiency and extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6678AXCYP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

80

No. of Terminals:

841

No. of Timers:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6678AXCYP Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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