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TMS320C6670CYPA2

Texas Instruments

TMS320C6670CYPA2 by Texas Instruments

TMS320C6670CYPA2 by Texas Instruments is a 32-bit DSP with integrated cache, operating at max 312.5 MHz clock frequency. Ideal for industrial applications, it features 64-bit external data bus width and low power mode for efficient performance in digital signal processing tasks. With 80 DMA channels and 16 timers, this CMOS technology-based processor offers high-speed data processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,733 parts In-Stock

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Digiode

USA . 1,892 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 825 parts In-Stock

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$16.393

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One Stop Electronics

USA . 1,453 parts In-Stock

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$34.000

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Corohmni

South Africa . 884 parts In-Stock

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Parana Technologies

USA . 689 parts In-Stock

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$65.667

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DigiPath Technology Company

USA . 1,521 parts In-Stock

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$72.307

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$66.523

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IDEA Electronic Components Group

UK . 1,550 parts In-Stock

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$73.783

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$70.094

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$66.405

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ChromeModa Solutions

Germany . 106 parts In-Stock

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$73.783

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$60.502

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QUARKTWIN TECHNOLOGY LTD

USA . 7,683 parts In-Stock

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Microchip USA

USA . 4,204 parts In-Stock

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Corphita

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Overview

Experience the power of cutting-edge technology with the TMS320C6670CYPA2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors that excel in a variety of applications. With integrated cache, multiple power supply options, and high clock frequency, this DSP offers unmatched performance and efficiency. Whether you're working on audio processing, image recognition, or telecommunications, the TMS320C6670CYPA2 provides the value, benefits, and advantages you need to take your projects to the next level. Upgrade your designs today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, making it suitable for a wide range of environments.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data and instructions closer to the processor, reducing access time and improving overall performance.

Maximum Supply Voltage: 1.05 V

Allows for efficient power consumption while providing enough voltage to support the processing needs of the DSP.

Address Bus Width: 16

Enables the DSP to access a larger memory address space, allowing for more data storage and processing capabilities.

Bit Size: 32

Provides high computational power and precision for processing complex digital signals and algorithms.

Power Supplies (V): 1, 1.5, 1.8

Offers flexibility in power options, allowing the DSP to be used in various applications with different power requirements.

No. of Terminals: 841

Provides ample connectivity options for interfacing with other devices and peripherals, making the DSP versatile in a range of systems.

Maximum Operating Temperature: 100 °C

Ensures reliable operation in harsh industrial environments with high temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Combines the capabilities of a digital signal processor with mixed-signal processing functions, making it suitable for a wide range of signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6670CYPA2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

312.5 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

80

No. of Terminals:

841

No. of Timers:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6670CYPA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.7.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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