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TMS320C6670ACYP2

Texas Instruments

TMS320C6670ACYP2 by Texas Instruments

TMS320C6670ACYP2 by Texas Instruments is a 32-bit DSP with integrated cache, operating at 1.05V max supply voltage. Ideal for digital signal processing applications, it features 841 terminals, 32768 RAM words, and supports floating-point format. With low power mode and boundary scan capability, this CMOS technology-based processor offers high performance in a compact square package.

Median Price

$317.988

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,361 parts In-Stock

1+ parts

$205.793

100+ parts

$186.278

1k+ parts

$177.408

10k+ parts

-

1,361

$205.793

$186.278

$177.408

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Mouser Electronics

USA . 6 parts In-Stock

1+ parts

$347.520

100+ parts

$294.040

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-

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6

$347.520

$294.040

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DigiKey

USA . 44 parts In-Stock

1+ parts

$347.580

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-

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44

$347.580

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Avnet

USA . 17 parts In-Stock

1+ parts

-

100+ parts

$288.457

1k+ parts

$265.536

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17

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$288.457

$265.536

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Distributors (In-Stock)

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Digiode

USA . 2,415 parts In-Stock

1+ parts

$195.503

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2,415

$195.503

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Vyrian

USA . 4,280 parts In-Stock

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4,280

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Bristol Electronics

USA . 2,200 parts In-Stock

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2,200

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Component Sense

UK . 86 parts In-Stock

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86

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Distributors (Availability)

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Parana Technologies

USA . 1,251 parts In-Stock

1+ parts

$20.199

100+ parts

$1,875.824

1k+ parts

$18.179

10k+ parts

-

1,251

$20.199

$1,875.824

$18.179

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DigiPath Technology Company

USA . 59 parts In-Stock

1+ parts

$22.242

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59

$22.242

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ChromeModa Solutions

Germany . 3,822 parts In-Stock

1+ parts

$22.696

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$18.611

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3,822

$22.696

$18.611

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IDEA Electronic Components Group

UK . 1,134 parts In-Stock

1+ parts

$22.696

100+ parts

$21.561

1k+ parts

$20.426

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1,134

$22.696

$21.561

$20.426

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$37.489

100+ parts

$34.115

1k+ parts

$30.741

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1,000

$37.489

$34.115

$30.741

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Corphita

USA . 1,769 parts In-Stock

1+ parts

$185.214

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1,769

$185.214

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Microchip USA

USA . 1,952 parts In-Stock

1+ parts

$269.810

100+ parts

$262.620

1k+ parts

$259.020

10k+ parts

$255.420

1,952

$269.810

$262.620

$259.020

$255.420

Corohmni

South Africa . 1,184 parts In-Stock

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$272.940

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1,184

$272.940

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Kepictronics

USA . 2,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,112 parts In-Stock

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Lixinc

USA . 1,492 parts In-Stock

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1,492

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Futuretech Components

Singapore . 420 parts In-Stock

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420

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Perfect Parts

USA . 30 parts In-Stock

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30

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Overview

Unleash the power of innovation with the TMS320C6670ACYP2 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and reliability. This versatile DSP is perfect for a wide range of applications, offering customers unmatched value and performance. With integrated cache, multiple power supply options, and advanced technology, this product provides the tools you need to take your projects to the next level. Experience the benefits of cutting-edge technology with the TMS320C6670ACYP2 and unlock endless possibilities in signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost, making the product long-lasting and affordable.

Integrated Cache: YES

The integrated cache improves processing speed and efficiency, enhancing overall performance.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage is optimized for power efficiency without compromising performance.

Bit Size: 32

The 32-bit size allows for processing of larger amounts of data at a time, improving speed and accuracy.

Terminal Finish: TIN SILVER COPPER

This finish provides reliable conductivity and corrosion resistance, ensuring stable performance over time.

RAM Words: 32768

The ample RAM words provide sufficient memory for processing complex algorithms and data sets.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the product energy-efficient and responsive.

No. of DMA Channels: 80

The high number of DMA channels allows for efficient data transfer and multitasking capabilities.

Low Power Mode: YES

The low power mode enhances energy efficiency, making the product suitable for battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6670ACYP2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

80

No. of Terminals:

841

No. of Timers:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6670ACYP2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.7.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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