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TMS320C6655GZHA

Texas Instruments

TMS320C6655GZHA by Texas Instruments

TMS320C6655GZHA by Texas Instruments is a 32-bit DSP with integrated cache, 8-bit on-chip data RAM, and 24-bit address bus width. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include multiple internal bus architecture, 72 DMA channels, and floating-point format for efficient signal processing.

Median Price

$134.322

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 408 parts In-Stock

1+ parts

$98.643

100+ parts

$95.677

1k+ parts

$74.168

10k+ parts

-

408

$98.643

$95.677

$74.168

-

Mouser Electronics

USA . 42 parts In-Stock

1+ parts

$170.000

100+ parts

$136.730

1k+ parts

-

10k+ parts

-

42

$170.000

$136.730

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,573 parts In-Stock

1+ parts

$93.711

100+ parts

-

1k+ parts

-

10k+ parts

-

2,573

$93.711

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-

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Vyrian

USA . 3,944 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,944

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 477 parts In-Stock

1+ parts

$26.609

100+ parts

-

1k+ parts

$27.172

10k+ parts

-

477

$26.609

-

$27.172

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DigiPath Technology Company

USA . 1,390 parts In-Stock

1+ parts

$29.300

100+ parts

$26.956

1k+ parts

-

10k+ parts

-

1,390

$29.300

$26.956

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-

ChromeModa Solutions

Germany . 2,639 parts In-Stock

1+ parts

$29.898

100+ parts

$24.516

1k+ parts

-

10k+ parts

-

2,639

$29.898

$24.516

-

-

IDEA Electronic Components Group

UK . 1,721 parts In-Stock

1+ parts

$29.898

100+ parts

$28.403

1k+ parts

$26.908

10k+ parts

-

1,721

$29.898

$28.403

$26.908

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Corohmni

South Africa . 182 parts In-Stock

1+ parts

$80.576

100+ parts

-

1k+ parts

-

10k+ parts

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182

$80.576

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-

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Ampacity Inc.

Singapore . 227 parts In-Stock

1+ parts

$83.850

100+ parts

-

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227

$83.850

-

-

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Corphita

USA . 2,958 parts In-Stock

1+ parts

$88.779

100+ parts

-

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2,958

$88.779

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-

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Microchip USA

USA . 2,496 parts In-Stock

1+ parts

$204.907

100+ parts

-

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2,496

$204.907

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Lixinc

USA . 17,344 parts In-Stock

1+ parts

-

100+ parts

-

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17,344

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,000

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Overview

Unleash the power of innovation with the TMS320C6655GZHA by Texas Instruments. As a leading manufacturer in digital signal processors, Texas Instruments delivers cutting-edge technology that sets the standard in performance and reliability. Ideal for a wide range of applications, this DSP offers seamless integration, high-speed data processing, and low power consumption. Elevate your projects with the exceptional quality and value that only Texas Instruments can provide. Experience the difference with the TMS320C6655GZHA today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components inside, making this DSP reliable for long-term use.

Integrated Cache: YES

Integrated cache helps improve the processing speed by storing frequently accessed data, enhancing the overall performance of the DSP.

Address Bus Width: 24

A wider address bus allows the DSP to access a larger memory space, enabling it to handle more complex tasks and store more data efficiently.

Bit Size: 32

With a 32-bit architecture, this DSP can handle data in larger chunks, leading to faster processing speeds and better overall performance.

Power Supplies (V): 1, 1.5, 1.8

Having multiple power supply options allows for flexibility in different operating conditions, ensuring that the DSP can be used in various environments.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature tolerance of 100°C makes this DSP suitable for industrial applications where heat resistance is crucial.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The specific designation as a digital signal processor highlights the specialized nature of this product, making it ideal for tasks that require high-speed signal processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6655GZHA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e0

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

625

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.99 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

21 mm

Peripheral IC Type:

Trade Compliance

TMS320C6655GZHA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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