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TMS320C6655CZH25

Texas Instruments

TMS320C6655CZH25 by Texas Instruments

TMS320C6655CZH25 by Texas Instruments is a 32-bit DSP with integrated cache and 8-bit on-chip data RAM. It features 625 terminals, operates b/w 0-85°C, and has a peak reflow temperature of 245°C. Ideal for digital signal processing applications requiring low power mode and floating-point format.

Median Price

$98.514

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 304 parts In-Stock

1+ parts

$76.369

100+ parts

$74.072

1k+ parts

$57.420

10k+ parts

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304

$76.369

$74.072

$57.420

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DigiKey

USA . 60 parts In-Stock

1+ parts

$120.660

100+ parts

$93.251

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-

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60

$120.660

$93.251

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-

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$63.443

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100

$63.443

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Digiode

USA . 4,429 parts In-Stock

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$72.551

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$72.551

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Vyrian

USA . 2,988 parts In-Stock

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2,988

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Chip Stock

USA . 135 parts In-Stock

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135

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Distributors (Availability)

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AZTECH Wire

Italy . 530 parts In-Stock

1+ parts

$19.416

100+ parts

-

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530

$19.416

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Parana Technologies

USA . 61 parts In-Stock

1+ parts

$24.296

100+ parts

-

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$24.957

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61

$24.296

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$24.957

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DigiPath Technology Company

USA . 1,030 parts In-Stock

1+ parts

$26.753

100+ parts

$24.613

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1,030

$26.753

$24.613

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ChromeModa Solutions

Germany . 2,673 parts In-Stock

1+ parts

$27.299

100+ parts

$22.385

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2,673

$27.299

$22.385

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IDEA Electronic Components Group

UK . 1,433 parts In-Stock

1+ parts

$27.299

100+ parts

$25.934

1k+ parts

$24.569

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1,433

$27.299

$25.934

$24.569

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Continental Prestige Electronics

USA . 1,008 parts In-Stock

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$56.007

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$54.887

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$56.007

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$54.887

Corohmni

South Africa . 710 parts In-Stock

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$60.727

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710

$60.727

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$63.443

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$60.271

10k+ parts

$59.002

1,000

$63.443

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$60.271

$59.002

Ampacity Inc.

Singapore . 182 parts In-Stock

1+ parts

$64.910

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$64.910

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Corphita

USA . 390 parts In-Stock

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$68.732

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$68.732

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Argo Parts USA

USA . 866 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320C6655CZH25 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Digital Signal Processors that are trusted by professionals worldwide. The TMS320C6655CZH25 offers unparalleled performance and efficiency, making it perfect for a wide range of applications. Experience seamless operation and enhanced productivity with this innovative product, designed to meet all your needs and exceed your expectations. Choose Texas Instruments for reliability, precision, and unmatched value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product affordable and easy to handle during assembly.

Integrated Cache: YES

Integrated cache helps improve processing speed by storing frequently used data and instructions, enhancing the overall performance of the DSP.

Surface Mount: YES

Surface mount technology makes it easier to assemble the DSP onto circuit boards, saving space and reducing production costs.

Bit Size: 32

A larger bit size allows for more complex calculations and processing capabilities, making the DSP suitable for demanding applications.

Power Supplies (V): 1, 1.5, 1.8

Support for multiple power supply options gives flexibility in designing power-efficient systems using the DSP.

RAM Words: 8192

With a large RAM capacity, the DSP can efficiently handle a significant amount of data and perform tasks quickly.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in various environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being specifically designed as a digital signal processor, this product is optimized for processing signals and data, making it a reliable choice for signal processing applications.

No. of DMA Channels: 72

With a high number of DMA channels, the DSP can efficiently manage data transfer between peripherals and memory, improving overall system performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6655CZH25 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

625

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.99 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

TMS320C6655CZH25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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