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TMS320C6455BZTZ8

Texas Instruments

TMS320C6455BZTZ8 by Texas Instruments

TMS320C6455BZTZ8 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at max 66.6 MHz clock frequency. Ideal for digital signal processing applications requiring low power mode and fixed-point format, with a wide temperature range of 0-90°C.

Median Price

$193.670

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 927 parts In-Stock

1+ parts

$178.090

100+ parts

$167.400

1k+ parts

$156.720

10k+ parts

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927

$178.090

$167.400

$156.720

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DigiKey

USA . 944 parts In-Stock

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944

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Verical

USA . 911 parts In-Stock

1+ parts

-

100+ parts

$209.250

1k+ parts

$195.900

10k+ parts

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911

-

$209.250

$195.900

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,495 parts In-Stock

1+ parts

$196.441

100+ parts

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4,495

$196.441

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Vyrian

USA . 4,866 parts In-Stock

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4,866

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DigiKey Marketplace

USA . 944 parts In-Stock

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944

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Distributors (Availability)

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Corohmni

South Africa . 2,661 parts In-Stock

1+ parts

$24.305

100+ parts

-

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2,661

$24.305

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Parana Technologies

USA . 1,510 parts In-Stock

1+ parts

$59.639

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1,510

$59.639

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ChromeModa Solutions

Germany . 2,929 parts In-Stock

1+ parts

$67.010

100+ parts

$54.948

1k+ parts

-

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2,929

$67.010

$54.948

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IDEA Electronic Components Group

UK . 588 parts In-Stock

1+ parts

$67.010

100+ parts

$63.660

1k+ parts

$60.309

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588

$67.010

$63.660

$60.309

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Ampacity Inc.

Singapore . 761 parts In-Stock

1+ parts

$175.760

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761

$175.760

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Corphita

USA . 408 parts In-Stock

1+ parts

$186.102

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408

$186.102

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QUARKTWIN TECHNOLOGY LTD

USA . 29,293 parts In-Stock

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Microchip USA

USA . 4,692 parts In-Stock

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4,692

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DigiPath Technology Company

USA . 1,506 parts In-Stock

1+ parts

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$60.416

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1,506

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$60.416

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Metaverse IC Inc.

Canada . 335 parts In-Stock

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335

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Overview

Experience unparalleled performance and efficiency with the TMS320C6455BZTZ8 by Texas Instruments, a leading manufacturer in the industry. As a top-of-the-line digital signal processor, this product offers a wide range of applications in various fields. With its cutting-edge technology and reliable design, customers can expect superior quality, unmatched value, and exceptional benefits. Trust Texas Instruments to deliver top-notch products that meet your needs and exceed your expectations. Choose the TMS320C6455BZTZ8 for optimal performance and seamless integration in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Maximum Supply Voltage: 1.236 V

Ability to handle higher supply voltage ensures stability and reliability in various operating conditions.

Bit Size: 32

Higher bit size allows for more precision in processing data and performing complex calculations.

Maximum Operating Temperature: 90 °C

Ability to operate at high temperatures enables usage in harsh environments without overheating.

RAM Words: 32768

Generous RAM capacity allows for efficient data storage and retrieval during processing tasks.

Maximum Clock Frequency: 66.6 MHz

High clock frequency enables fast data processing and execution of instructions, improving overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing energy efficiency and reliability.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6455BZTZ8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.236 V

Minimum Supply Voltage:

1.164 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6455BZTZ8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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