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TMS320C6455BZTZ7

Texas Instruments

TMS320C6455BZTZ7 by Texas Instruments

TMS320C6455BZTZ7 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at 66.6 MHz. It features 32768 RAM words and operates b/w temperatures of 0-90°C. Ideal for digital signal processing applications requiring high-speed performance in a compact form factor.

Median Price

$164.145

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 787 parts In-Stock

1+ parts

$150.940

100+ parts

$141.880

1k+ parts

$132.830

10k+ parts

-

787

$150.940

$141.880

$132.830

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DigiKey

USA . 808 parts In-Stock

1+ parts

-

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-

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808

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Verical

USA . 429 parts In-Stock

1+ parts

-

100+ parts

$177.350

1k+ parts

$166.037

10k+ parts

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429

-

$177.350

$166.037

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,201 parts In-Stock

1+ parts

$166.497

100+ parts

-

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4,201

$166.497

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Vyrian

USA . 3,607 parts In-Stock

1+ parts

-

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3,607

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$16.544

100+ parts

$15.055

1k+ parts

$13.566

10k+ parts

-

550

$16.544

$15.055

$13.566

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Parana Technologies

USA . 222 parts In-Stock

1+ parts

$20.383

100+ parts

-

1k+ parts

$20.413

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222

$20.383

-

$20.413

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DigiPath Technology Company

USA . 1,706 parts In-Stock

1+ parts

$22.444

100+ parts

$20.648

1k+ parts

-

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1,706

$22.444

$20.648

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ChromeModa Solutions

Germany . 2,867 parts In-Stock

1+ parts

$22.902

100+ parts

$18.780

1k+ parts

-

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2,867

$22.902

$18.780

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IDEA Electronic Components Group

UK . 715 parts In-Stock

1+ parts

$22.902

100+ parts

$21.757

1k+ parts

$20.612

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715

$22.902

$21.757

$20.612

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Corohmni

South Africa . 2,612 parts In-Stock

1+ parts

$56.536

100+ parts

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2,612

$56.536

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Corphita

USA . 4,063 parts In-Stock

1+ parts

$157.734

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4,063

$157.734

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Component Stockers USA

USA . 2,159 parts In-Stock

1+ parts

$178.630

100+ parts

$167.910

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2,159

$178.630

$167.910

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Microchip USA

USA . 4,708 parts In-Stock

1+ parts

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4,708

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QUARKTWIN TECHNOLOGY LTD

USA . 2,180 parts In-Stock

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2,180

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Overview

Experience the power of Texas Instruments with the TMS320C6455BZTZ7 Digital Signal Processor. This cutting-edge technology offers high-quality performance and reliability for a wide range of applications. With its advanced features and superior design, this DSP provides customers with unmatched value and benefits. Trust in Texas Instruments to deliver top-of-the-line products that exceed expectations. Elevate your projects to new heights with the TMS320C6455BZTZ7 DSP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, ensuring reliable performance in various environments.

Bit Size: 32

A 32-bit architecture allows for high-speed processing of complex digital signals, making this DSP suitable for advanced applications.

Maximum Clock Frequency: 66.6 MHz

The high clock frequency enables fast data processing, making the DSP efficient for real-time signal processing tasks.

RAM Words: 32768

With a large RAM capacity, this DSP can store and manipulate a significant amount of data, enhancing its capabilities in handling complex algorithms and computations.

Low Power Mode: YES

The low power mode feature helps in conserving energy consumption, making the DSP more energy-efficient and suitable for portable or battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6455BZTZ7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.236 V

Minimum Supply Voltage:

1.164 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6455BZTZ7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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