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TMS320C6455BGTZ7

Texas Instruments

TMS320C6455BGTZ7 by Texas Instruments

TMS320C6455BGTZ7 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at 66.6 MHz. It features 32768 RAM words and operates b/w temperatures of 0-90°C. Ideal for digital signal processing applications requiring low power consumption and high-speed data processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,638 parts In-Stock

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Digiode

USA . 4,429 parts In-Stock

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4,429

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Distributors (Availability)

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AZTECH Wire

Italy . 480 parts In-Stock

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$9.517

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480

$9.517

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Parana Technologies

USA . 596 parts In-Stock

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$17.956

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$18.123

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596

$17.956

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DigiPath Technology Company

USA . 231 parts In-Stock

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$19.772

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$18.190

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$18.190

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IDEA Electronic Components Group

UK . 1,297 parts In-Stock

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$20.175

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$19.166

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$18.158

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1,297

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$18.158

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ChromeModa Solutions

Germany . 268 parts In-Stock

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$20.175

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$16.544

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268

$20.175

$16.544

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One Stop Electronics

USA . 1,030 parts In-Stock

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$27.000

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$27.000

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Corohmni

South Africa . 73 parts In-Stock

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$33.455

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Corphita

USA . 4,394 parts In-Stock

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Microchip USA

USA . 391 parts In-Stock

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Overview

Experience the power and precision of the TMS320C6455BGTZ7 by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology. As a digital signal processor (DSP), this product boasts unparalleled performance in a variety of applications. From telecommunications to industrial control systems, this DSP delivers unmatched speed and efficiency. With a wide range of features and capabilities, the TMS320C6455BGTZ7 offers customers exceptional value, reliability, and innovation. Upgrade your projects with the best in DSP technology and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability while keeping the overall weight of the product low.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.236 V

Optimal voltage for efficient performance without risking damage to the product.

Address Bus Width: 20

Facilitates efficient communication between memory and other devices in the system.

Bit Size: 32

High bit size provides better processing capabilities and precision in calculations.

Power Supplies (V): 1.2

Stable power supply ensures consistent and reliable operation.

No. of Terminals: 697

Sufficient terminals for connectivity and expansion options.

Package Style (Meter): GRID ARRAY, FINE PITCH

Facilitates high-density packaging and efficient heat dissipation.

Minimum Supply Voltage: 1.164 V

Provides a safe operating range for the product while ensuring stability.

Maximum Operating Temperature: 90 °C

Can withstand high temperatures, suitable for various environments.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures without compromising performance.

Terminal Finish: TIN LEAD

Provides good electrical conductivity and solderability for reliable connections.

RAM Words: 32768

Sufficient memory capacity for storing and manipulating data efficiently.

Width: 24 mm

Compact size for easy integration into different systems or devices.

Boundary Scan: YES

Allows for efficient testing and debugging of the DSP during development or production.

External Data Bus Width: 64

Wide data bus width for faster data transfer and processing.

Maximum Clock Frequency: 66.6 MHz

High clock frequency enables fast computations and response times.

Maximum Time At Peak Reflow Temperature (s): 20

Optimal reflow time for soldering process, ensuring a reliable connection.

Peak Reflow Temperature °C: 220

Suitable temperature for soldering process without damaging the components.

Internal Bus Architecture: MULTIPLE

Efficient internal bus architecture for better data flow and processing speed.

Length: 24 mm

Compact size for space-saving in installation and design.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated peripheral IC for advanced signal processing tasks.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation.

Terminal Form: BALL

Ball terminals provide secure connections and are suitable for SMT applications.

Nominal Supply Voltage: 1.2 V

Stable and reliable supply voltage for consistent performance.

Terminal Pitch: 0.8 mm

Fine terminal pitch for high-density packaging and space efficiency.

Format: FIXED POINT

Fixed point format for precise arithmetic operations and efficient calculations.

Moisture Sensitivity Level (MSL): 4

Suitable MSL rating for storage and handling in various environments.

Low Power Mode: YES

Ability to operate in low power mode for energy efficiency and extended battery life.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6455BGTZ7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e0

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.236 V

Minimum Supply Voltage:

1.164 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6455BGTZ7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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