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TMS320C6421ZWTL

Texas Instruments

TMS320C6421ZWTL by Texas Instruments

TMS320C6421ZWTL by Texas Instruments is a 32-bit DSP with 22-bit address bus, operating at max 400 MHz. It features 12288 RAM words, Boundary Scan support, and operates b/w 0-70°C. Ideal for digital signal processing applications requiring high-speed data processing in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,836 parts In-Stock

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Vyrian

USA . 2,319 parts In-Stock

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2,319

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Distributors (Availability)

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AZTECH Wire

Italy . 594 parts In-Stock

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$11.573

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$11.573

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Corohmni

South Africa . 72 parts In-Stock

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$24.582

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72

$24.582

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Parana Technologies

USA . 38 parts In-Stock

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$26.510

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$2,461.813

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$23.859

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38

$26.510

$2,461.813

$23.859

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DigiPath Technology Company

USA . 1,240 parts In-Stock

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$29.190

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$26.855

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$29.190

$26.855

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ChromeModa Solutions

Germany . 2,819 parts In-Stock

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$29.786

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$24.425

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$29.786

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IDEA Electronic Components Group

UK . 2,070 parts In-Stock

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$29.786

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$28.297

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$26.807

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2,070

$29.786

$28.297

$26.807

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One Stop Electronics

USA . 165 parts In-Stock

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$32.000

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Corphita

USA . 1,818 parts In-Stock

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Microchip USA

USA . 325 parts In-Stock

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Overview

Experience unmatched performance and innovation with the TMS320C6421ZWTL by Texas Instruments. As a leading manufacturer in the industry of Digital Signal Processors (DSPs), Texas Instruments is known for delivering high-quality products that exceed expectations. The TMS320C6421ZWTL offers unparalleled value and benefits, making it perfect for a wide range of applications. Whether you're looking to enhance your audio processing capabilities, improve image processing speed, or optimize your telecommunications systems, this product has you covered. Stay ahead of the curve with Texas Instruments and unlock new possibilities with the TMS320C6421ZWTL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the DSP, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 1.1 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation, making the DSP energy-efficient.

Address Bus Width: 22

Having a wide address bus width enables the DSP to access a large memory space, increasing its processing capabilities.

Bit Size: 32

32-bit architecture allows the DSP to handle complex calculations and data processing tasks effectively and efficiently.

Power Supplies (V): 1.2, 1.8, 3.3

Multiple power supply options provide flexibility in different application scenarios, ensuring compatibility with various systems.

No. of Terminals: 361

Having a high number of terminals allows for better connectivity and interfacing with other components, enhancing overall system integration.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style offers a compact and space-saving design, making it suitable for applications where size constraints are a concern.

Minimum Supply Voltage: 1 V

Low minimum supply voltage ensures stable operation of the DSP even under low power conditions, improving reliability.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows the DSP to perform consistently in varying environmental conditions, increasing its versatility.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures ensures the DSP can function in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

Terminal finish with Tin, Silver, and Copper provides good conductivity and corrosion resistance, ensuring reliable connections.

Maximum Seated Height: 1.4 mm

Low seated height allows for a slim profile, making the DSP suitable for compact devices or applications with limited space.

RAM Words: 12288

Generous amount of RAM words enables the DSP to store and process large amounts of data efficiently, enhancing its performance.

Width: 16 mm

Compact width makes the DSP easy to integrate into different systems or devices without taking up too much space.

Boundary Scan: YES

Boundary scan capability allows for efficient debugging and testing of the DSP during the manufacturing or maintenance process.

External Data Bus Width: 8

Having an external data bus width of 8 bits allows for fast data transfer between the DSP and external peripherals, improving overall system performance.

Maximum Clock Frequency: 400 MHz

High maximum clock frequency enables the DSP to process data at a fast rate, making it suitable for real-time applications or tasks that require quick responses.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the DSP can be quickly and efficiently soldered onto PCBs, reducing assembly time and improving manufacturing efficiency.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the DSP can withstand the heat stress during the soldering process without damage.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for efficient data transfer and processing within the DSP, enhancing its overall performance.

Length: 16 mm

Compact length makes the DSP suitable for various applications where space is a constraint, without compromising on functionality.

Temperature Grade: COMMERCIAL

With a commercial temperature grade, the DSP is designed for typical operating conditions, making it versatile for a wide range of applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with other peripheral IC types, this product offers diverse functionality and can be used in multiple applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various systems, making the DSP energy-efficient and reliable.

Terminal Form: BALL

Terminal form with ball contacts provides good electrical connection and reliability, ensuring stable operation of the DSP in different environments.

Nominal Supply Voltage: 1.05 V

Having a nominal supply voltage of 1.05V ensures consistent and stable power delivery to the DSP, enhancing its performance and reliability.

Terminal Pitch: 0.8 mm

With a fine terminal pitch of 0.8mm, the DSP allows for dense mounting on PCBs, saving space and enabling high-density integration.

Format: FIXED POINT

Fixed-point format provides precise and efficient numeric representation for calculations, enhancing the DSP's accuracy and performance.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate moisture sensitivity, ensuring the DSP can withstand typical storage and handling conditions without degradation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6421ZWTL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

400 MHz

External Data Bus Width:

8

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

12288

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6421ZWTL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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