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TMS320C6421ZDU7

Texas Instruments

TMS320C6421ZDU7 by Texas Instruments

TMS320C6421ZDU7 by Texas Instruments is a 32-bit DSP with 700 MHz clock frequency, 12288 RAM words, and 22-bit address bus width. Ideal for digital signal processing applications due to its integrated cache, multiple internal bus architecture, and 72 DMA channels.

Median Price

$38.794

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,800 parts In-Stock

1+ parts

$38.794

100+ parts

$33.887

1k+ parts

$23.370

10k+ parts

-

4,800

$38.794

$33.887

$23.370

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Rochester

USA . 88 parts In-Stock

1+ parts

-

100+ parts

$33.590

1k+ parts

$30.060

10k+ parts

$28.290

88

-

$33.590

$30.060

$28.290

DigiKey

USA . 88 parts In-Stock

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88

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Verical

USA . 64 parts In-Stock

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-

100+ parts

$41.987

1k+ parts

$37.575

10k+ parts

$35.362

64

-

$41.987

$37.575

$35.362

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,369 parts In-Stock

1+ parts

$30.837

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2,369

$30.837

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Vyrian

USA . 6,164 parts In-Stock

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6,164

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Bristol Electronics

USA . 85 parts In-Stock

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Atlantic Semiconductor

USA . 85 parts In-Stock

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85

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Distributors (Availability)

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$21.513

100+ parts

$19.577

1k+ parts

$17.641

10k+ parts

-

1,000

$21.513

$19.577

$17.641

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Corphita

USA . 4,295 parts In-Stock

1+ parts

$29.214

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4,295

$29.214

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Corohmni

South Africa . 5,231 parts In-Stock

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$29.220

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$29.220

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Parana Technologies

USA . 30 parts In-Stock

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$69.108

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30

$69.108

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DigiPath Technology Company

USA . 587 parts In-Stock

1+ parts

$76.097

100+ parts

$70.009

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587

$76.097

$70.009

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ChromeModa Solutions

Germany . 2,253 parts In-Stock

1+ parts

$77.650

100+ parts

$63.673

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2,253

$77.650

$63.673

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IDEA Electronic Components Group

UK . 1,665 parts In-Stock

1+ parts

$77.650

100+ parts

$73.768

1k+ parts

$69.885

10k+ parts

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1,665

$77.650

$73.768

$69.885

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Overview

Unlock the power of digital signal processing with the TMS320C6421ZDU7 by Texas Instruments. Known for its superior quality and reliability, Texas Instruments offers a range of applications for their category-leading DSPs. Experience seamless integration with integrated cache and surface mount capabilities, providing customers with unparalleled performance. With a maximum clock frequency of 700 MHz and multiple internal bus architecture, this product delivers high-speed processing for a wide range of tasks. Trust in Texas Instruments to provide cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection to the DSP, making it suitable for various environments and applications.

Integrated Cache: YES

Integrated cache helps in improving the speed and efficiency of the DSP by storing frequently accessed data for quick retrieval, enhancing overall performance.

Maximum Supply Voltage: 1.26 V

Having a maximum supply voltage of 1.26V ensures safe operation of the DSP within the specified voltage range, contributing to its reliability.

Address Bus Width: 22

A wider address bus width of 22 allows the DSP to access a larger memory space and handle complex computational tasks efficiently.

Maximum Clock Frequency: 700 MHz

With a high maximum clock frequency of 700 MHz, this DSP can process data at a faster rate, making it suitable for real-time signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6421ZDU7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY AT 560MHZ

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

700 MHz

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

376

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

12288

ROM Programmability:

MROM

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6421ZDU7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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