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TMS320C6416TBZLZ7

Texas Instruments

TMS320C6416TBZLZ7 by Texas Instruments

TMS320C6416TBZLZ7 by Texas Instruments is a 32-bit DSP with 23-bit address bus width, 64-bit external data bus width, and max clock frequency of 75 MHz. It is used in digital signal processing applications requiring high computational power and low power consumption.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 8,081 parts In-Stock

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Digiode

USA . 4,202 parts In-Stock

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Semtec, LLC

USA . 3 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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AZTECH Wire

Italy . 693 parts In-Stock

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$11.432

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One Stop Electronics

USA . 1,214 parts In-Stock

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$23.000

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Parana Technologies

USA . 699 parts In-Stock

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$24.022

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$24.680

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Corohmni

South Africa . 88 parts In-Stock

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$25.834

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DigiPath Technology Company

USA . 658 parts In-Stock

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$26.451

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ChromeModa Solutions

Germany . 1,839 parts In-Stock

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$26.991

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$22.133

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IDEA Electronic Components Group

UK . 1,430 parts In-Stock

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$26.991

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$25.641

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$24.292

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Component Stockers USA

USA . 648 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unlock the power of advanced digital signal processing with the TMS320C6416TBZLZ7 by Texas Instruments. Designed with precision and expertise, this DSP offers unparalleled quality and reliability for a wide range of applications. From audio and video processing to telecommunications and industrial control systems, this versatile processor delivers exceptional performance and efficiency. Experience the value and benefits of cutting-edge technology with the TMS320C6416TBZLZ7, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the DSP, making it reliable for extended use.

Maximum Supply Voltage: 1.24 V

The low maximum supply voltage helps in reducing power consumption and extending battery life in portable devices where the DSP may be used.

Address Bus Width: 23

The larger address bus width allows for efficient handling of memory addresses, enabling faster data processing and improved performance.

Bit Size: 32

With a 32-bit architecture, the DSP is capable of handling complex mathematical operations and processing large amounts of data with high precision.

RAM Words: 16384

The large RAM allows for storing and accessing a significant amount of data in real-time, enhancing the overall processing speed and efficiency of the DSP.

Maximum Clock Frequency: 75 MHz

The high maximum clock frequency enables the DSP to execute instructions at a rapid pace, making it suitable for applications that require real-time signal processing.

Technology: CMOS

The CMOS technology used in the DSP ensures low power consumption, high speed, and reliability, making it an ideal choice for a wide range of applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of additional peripheral ICs tailored for digital signal processing enhances the functionality and versatility of the DSP for various use cases.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6416TBZLZ7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6416TBZLZ7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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