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TMS320C6415TBZLZW7

Texas Instruments

TMS320C6415TBZLZW7 by Texas Instruments

TMS320C6415TBZLZW7 by Texas Instruments is a 32-bit DSP with 532 terminals, operating b/w 0-90°C. It features power supplies of 1.1V and 3.3V, in a square package suitable for digital signal processing applications. The CMOS technology, 0.8mm terminal pitch, and fixed-point format make it ideal for various signal processing tasks.

Median Price

$219.262

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 111 parts In-Stock

1+ parts

$186.610

100+ parts

$175.410

1k+ parts

$164.220

10k+ parts

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111

$186.610

$175.410

$164.220

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DigiKey

USA . 111 parts In-Stock

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$233.260

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Verical

USA . 106 parts In-Stock

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$219.262

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$205.275

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106

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$219.262

$205.275

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,669 parts In-Stock

1+ parts

$205.846

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4,669

$205.846

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DigiKey Marketplace

USA . 111 parts In-Stock

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$225.350

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111

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Vyrian

USA . 4,959 parts In-Stock

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4,959

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Distributors (Availability)

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Corohmni

South Africa . 71 parts In-Stock

1+ parts

$32.381

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71

$32.381

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Parana Technologies

USA . 1 parts In-Stock

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$64.828

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1

$64.828

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DigiPath Technology Company

USA . 2,338 parts In-Stock

1+ parts

$71.383

100+ parts

$65.673

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2,338

$71.383

$65.673

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ChromeModa Solutions

Germany . 4,171 parts In-Stock

1+ parts

$72.840

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$59.729

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4,171

$72.840

$59.729

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IDEA Electronic Components Group

UK . 288 parts In-Stock

1+ parts

$72.840

100+ parts

$69.198

1k+ parts

$65.556

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288

$72.840

$69.198

$65.556

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Corphita

USA . 1,979 parts In-Stock

1+ parts

$195.012

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1,979

$195.012

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Component Stockers USA

USA . 139 parts In-Stock

1+ parts

$218.720

100+ parts

$205.600

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139

$218.720

$205.600

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QUARKTWIN TECHNOLOGY LTD

USA . 22,593 parts In-Stock

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22,593

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Overview

Discover the power of the TMS320C6415TBZLZW7 by Texas Instruments, a cutting-edge Digital Signal Processor that offers unparalleled performance and reliability. With Texas Instruments' reputation for excellence in engineering and innovation, this DSP is designed to meet the highest standards of quality and efficiency. Ideal for a wide range of applications, from telecommunications to audio processing, this product delivers exceptional value and advantages to customers looking for top-notch performance in a compact package. Experience the difference with the TMS320C6415TBZLZW7 and unlock a world of possibilities in digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for various applications without adding much weight or cost.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards, saving space and reducing manufacturing complexity.

Bit Size: 32

A 32-bit architecture allows for high-performance computing and processing capabilities, making the product suitable for demanding signal processing tasks.

Power Supplies (V): 1.1,3.3

Supporting multiple power supply options provides flexibility in system design and compatibility with different power sources.

No. of Terminals: 532

A high number of terminals enable robust connectivity and interface options, allowing for a wide range of input and output connections.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the product can perform reliably in harsh environmental conditions without overheating.

Technology: CMOS

Complementary metal-oxide-semiconductor (CMOS) technology offers low power consumption and high noise immunity, enhancing the product's efficiency and reliability.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6415TBZLZW7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320C6415TBZLZW7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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