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TMS320C6415TBZLZ6

Texas Instruments

TMS320C6415TBZLZ6 by Texas Instruments

TMS320C6415TBZLZ6 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 64-bit external data bus width, and 75 MHz max clock frequency. Ideal for digital signal processing applications requiring high-speed computation in a compact form factor.

Median Price

$105.682

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 279 parts In-Stock

1+ parts

-

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$93.940

1k+ parts

$84.050

10k+ parts

$79.100

279

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$93.940

$84.050

$79.100

DigiKey

USA . 279 parts In-Stock

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-

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279

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Verical

USA . 240 parts In-Stock

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$117.425

1k+ parts

$105.063

10k+ parts

$98.875

240

-

$117.425

$105.063

$98.875

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,195 parts In-Stock

1+ parts

$99.161

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$99.161

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DigiKey Marketplace

USA . 280 parts In-Stock

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$108.560

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Vyrian

USA . 3,078 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 227 parts In-Stock

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Bristol Electronics

USA . 88 parts In-Stock

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Connector Distribution Corp

USA . 18 parts In-Stock

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Right Parts Inc.

USA . 18 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,248 parts In-Stock

1+ parts

$29.829

100+ parts

-

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$63.729

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2,248

$29.829

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$63.729

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DigiPath Technology Company

USA . 1,721 parts In-Stock

1+ parts

$32.846

100+ parts

$30.218

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1,721

$32.846

$30.218

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ChromeModa Solutions

Germany . 6,170 parts In-Stock

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$33.516

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$27.483

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$33.516

$27.483

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IDEA Electronic Components Group

UK . 2,187 parts In-Stock

1+ parts

$33.516

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$31.840

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$30.164

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2,187

$33.516

$31.840

$30.164

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Corohmni

South Africa . 938 parts In-Stock

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$86.311

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Corphita

USA . 2,964 parts In-Stock

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$93.942

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2,964

$93.942

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Component Stockers USA

USA . 329 parts In-Stock

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$106.050

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$99.680

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$99.680

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QUARKTWIN TECHNOLOGY LTD

USA . 6,138 parts In-Stock

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Authorized Procurement Solutions

USA . 227 parts In-Stock

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Microchip USA

USA . 130 parts In-Stock

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Perfect Parts

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ChipTracer

USA . 88 parts In-Stock

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Overview

Experience unmatched performance and efficiency with the TMS320C6415TBZLZ6 by Texas Instruments. As a leader in the industry of Digital Signal Processors (DSPs), Texas Instruments delivers cutting-edge technology with a focus on quality and reliability. This powerful processor offers a wide range of applications, providing unparalleled value to customers seeking high-performance solutions. Trust Texas Instruments to elevate your projects with the TMS320C6415TBZLZ6, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components as it provides insulation and protection for the internal components of the DSP.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration of the DSP onto printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.24 V

With a low maximum supply voltage, this DSP is suitable for low power applications and helps to reduce power consumption.

Address Bus Width: 23

A wider address bus allows for increased memory addressing capabilities, enabling the DSP to access larger amounts of data efficiently.

Bit Size: 32

A 32-bit architecture allows for high-speed processing and complex calculations, making this DSP suitable for demanding signal processing tasks.

Power Supplies (V): 1.1,3.3

Support for multiple power supply voltages gives flexibility in design and allows for compatibility with different system requirements.

No. of Terminals: 532

Having a high number of terminals enables the DSP to interface with a variety of external components and peripherals, expanding its functionality.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this DSP suitable for a wide range of environments and applications, including industrial and automotive.

RAM Words: 262144

A large RAM capacity allows the DSP to store and manipulate a significant amount of data, improving efficiency and performance.

Maximum Clock Frequency: 75 MHz

A high clock frequency enables faster processing speed, making the DSP ideal for real-time signal processing and high-performance applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6415TBZLZ6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6415TBZLZ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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