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TMS320C6414TZLZ1

Texas Instruments

TMS320C6414TZLZ1 by Texas Instruments

TMS320C6414TZLZ1 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and operates at max frequency of 75 MHz. Ideal for digital signal processing applications requiring high-speed computation in a compact package.

Median Price

$264.863

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 38 parts In-Stock

1+ parts

$225.420

100+ parts

$211.890

1k+ parts

$198.370

10k+ parts

-

38

$225.420

$211.890

$198.370

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DigiKey

USA . 38 parts In-Stock

1+ parts

$281.780

100+ parts

-

1k+ parts

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10k+ parts

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38

$281.780

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-

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Verical

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$264.863

1k+ parts

$247.963

10k+ parts

-

30

-

$264.863

$247.963

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,844 parts In-Stock

1+ parts

$248.644

100+ parts

-

1k+ parts

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2,844

$248.644

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-

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DigiKey Marketplace

USA . 38 parts In-Stock

1+ parts

$272.200

100+ parts

-

1k+ parts

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38

$272.200

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-

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Vyrian

USA . 4,045 parts In-Stock

1+ parts

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4,045

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Component Sense

UK . 15 parts In-Stock

1+ parts

-

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,045 parts In-Stock

1+ parts

$62.474

100+ parts

-

1k+ parts

-

10k+ parts

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1,045

$62.474

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Corohmni

South Africa . 724 parts In-Stock

1+ parts

$65.935

100+ parts

-

1k+ parts

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724

$65.935

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ChromeModa Solutions

Germany . 5,858 parts In-Stock

1+ parts

$70.195

100+ parts

$57.560

1k+ parts

-

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5,858

$70.195

$57.560

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IDEA Electronic Components Group

UK . 359 parts In-Stock

1+ parts

$70.195

100+ parts

$66.685

1k+ parts

$63.176

10k+ parts

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359

$70.195

$66.685

$63.176

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Corphita

USA . 3,848 parts In-Stock

1+ parts

$235.557

100+ parts

-

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10k+ parts

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3,848

$235.557

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Microchip USA

USA . 972 parts In-Stock

1+ parts

$256.260

100+ parts

$249.430

1k+ parts

$246.010

10k+ parts

$242.600

972

$256.260

$249.430

$246.010

$242.600

QUARKTWIN TECHNOLOGY LTD

USA . 22,533 parts In-Stock

1+ parts

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22,533

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DigiPath Technology Company

USA . 1,608 parts In-Stock

1+ parts

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100+ parts

$63.288

1k+ parts

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10k+ parts

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1,608

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$63.288

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Overview

Unlock unparalleled performance and efficiency with the TMS320C6414TZLZ1 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers cutting-edge technology that revolutionizes the way we process data. Ideal for applications in telecommunications, audio processing, and industrial control systems, this DSP offers unmatched value and reliability. Experience lightning-fast speeds and seamless integration with the TMS320C6414TZLZ1, the ultimate solution for your processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring a longer product lifespan.

Surface Mount: YES

Surface mount technology makes the DSP easy to integrate into various electronic devices and PCBs, saving space and improving efficiency.

Maximum Supply Voltage: 1.24 V

The low maximum supply voltage ensures efficient power consumption and reduces the risk of overheating or electrical damage.

Address Bus Width: 23

A wider address bus allows for more memory addressing capabilities, which is essential for handling complex signal processing tasks efficiently.

Package Shape: SQUARE

The square package shape offers a compact design that is easier to manage during installation and integration into electronic devices.

Bit Size: 32

With a 32-bit architecture, this DSP can handle larger data sets and perform calculations with higher precision, making it suitable for demanding signal processing tasks.

Power Supplies (V): 1.2, 3.3

Having multiple power supply options allows for flexibility in different voltage requirements of electronic systems, making this DSP more versatile.

No. of Terminals: 532

A higher number of terminals provide more connection points for peripherals and external components, expanding the DSP's connectivity options.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables high-density mounting and precise connections, ideal for advanced electronic devices with limited space.

Minimum Supply Voltage: 1.16 V

The low minimum supply voltage ensures the DSP can operate efficiently even at low power levels, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range allows the DSP to function reliably in a variety of environments and conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the DSP can start up and operate effectively in colder conditions, making it versatile for different applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and connection processes, improving the overall usability and convenience of the DSP.

Maximum Seated Height: 3.25 mm

The low seated height makes the DSP more compact and suitable for slim electronic devices or applications where space is limited.

RAM Words: 16384

With a large RAM capacity, this DSP can store and process a significant amount of data quickly, enhancing its performance for signal processing tasks.

Width: 23 mm

The compact width of the DSP allows for easy integration into various electronic devices and PCB layouts, optimizing space usage.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during production, improving quality control and reliability of the final product.

External Data Bus Width: 64

A wider external data bus width allows for faster data transfer rates and improved processing speed, making this DSP suitable for high-performance applications.

Maximum Clock Frequency: 75 MHz

The high maximum clock frequency enables the DSP to process data and perform calculations at a rapid pace, meeting the demands of real-time signal processing applications.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enhances data throughput and efficiency, making the DSP capable of handling complex signal processing tasks effectively.

Length: 23 mm

The compact length of the DSP contributes to its overall small form factor, making it suitable for space-constrained electronic devices and applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types expands the DSP's compatibility and connectivity options, making it a versatile choice for different system configurations.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making this DSP an efficient and dependable solution for signal processing applications.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and improves the connectivity and reliability of the DSP in electronic assemblies.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures stable and consistent power delivery to the DSP, enhancing its performance and reliability in various operating conditions.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting and precise connections, making this DSP suitable for compact electronic devices and applications.

Format: FIXED POINT

A fixed-point format simplifies computation and reduces processing time, making this DSP optimized for handling signal processing tasks efficiently and accurately.

Low Power Mode: YES

The low power mode feature helps reduce power consumption and heat generation, extending the battery life of portable devices and enhancing energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6414TZLZ1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

532

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6414TZLZ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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