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TMS320C6414TBCLZ8

Texas Instruments

TMS320C6414TBCLZ8 by Texas Instruments

TMS320C6414TBCLZ8 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75 MHz. Ideal for digital signal processing applications requiring high-speed performance in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,124 parts In-Stock

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Vyrian

USA . 2,408 parts In-Stock

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One Stop Electronics

USA . 749 parts In-Stock

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$7.000

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749

$7.000

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AZTECH Wire

Italy . 653 parts In-Stock

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$16.736

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Parana Technologies

USA . 183 parts In-Stock

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$56.393

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ChromeModa Solutions

Germany . 4,083 parts In-Stock

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$63.363

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$51.958

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IDEA Electronic Components Group

UK . 537 parts In-Stock

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$63.363

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$60.195

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$57.027

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537

$63.363

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$57.027

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Corohmni

South Africa . 34 parts In-Stock

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$80.563

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Microchip USA

USA . 1,384 parts In-Stock

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$186.870

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$181.890

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$179.390

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$176.900

1,384

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$181.890

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$176.900

DigiPath Technology Company

USA . 2,059 parts In-Stock

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$57.128

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Corphita

USA . 1,665 parts In-Stock

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Overview

Enhance your digital signal processing projects with the TMS320C6414TBCLZ8 from Texas Instruments. With its cutting-edge technology and high-quality construction, this DSP offers unmatched performance and reliability. Perfect for a wide range of applications, this product provides customers with exceptional value and benefits, making it the ideal choice for any project requiring powerful signal processing capabilities. Trust Texas Instruments to deliver superior products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package provides good durability and protection for the internal components, making the product long-lasting.

Integrated Cache: YES

Integrated cache helps improve processing speed by storing frequently accessed data, enhancing overall performance.

Maximum Supply Voltage: 1.24 V

Higher maximum supply voltage allows for robust operation and flexibility in power supply requirements.

Address Bus Width: 20

Wider address bus width enables the processor to access a larger memory space, increasing its capability to handle complex tasks.

Package Shape: SQUARE

Square package shape provides efficient use of space and allows for easy integration into various systems.

Bit Size: 32

32-bit processing capability offers high computational performance and precision in handling digital signals.

Power Supplies (V): 1.2, 3.3

Multiple power supply options enable compatibility with different voltage requirements, enhancing product versatility.

No. of Terminals: 532

High number of terminals allow for various connections and interfaces, enabling the processor to communicate with multiple devices efficiently.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch package style offers high density and connectivity options, making it suitable for compact electronic designs.

Minimum Supply Voltage: 1.16 V

Low minimum supply voltage ensures efficient power consumption and reduces energy costs in operation.

Maximum Operating Temperature: 90 °C

High maximum operating temperature tolerance allows the processor to perform reliably in demanding environmental conditions.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6414TBCLZ8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6414TBCLZ8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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