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TMS320C6412AZNZ7

Texas Instruments

TMS320C6412AZNZ7 by Texas Instruments

TMS320C6412AZNZ7 by Texas Instruments is a 32-bit DSP with integrated cache, 64 external data bus width, and 75.19 MHz max clock frequency. Widely used in digital signal processing applications due to its low power mode, multiple internal bus architecture, and boundary scan feature.

Median Price

$122.322

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 187 parts In-Stock

1+ parts

$122.322

100+ parts

$108.731

1k+ parts

$79.949

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187

$122.322

$108.731

$79.949

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Rochester

USA . 33 parts In-Stock

1+ parts

-

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$114.930

1k+ parts

$102.830

10k+ parts

$96.780

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$102.830

$96.780

DigiKey

USA . 33 parts In-Stock

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Verical

USA . 30 parts In-Stock

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$143.662

1k+ parts

$128.537

10k+ parts

$120.975

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$143.662

$128.537

$120.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey Marketplace

USA . 33 parts In-Stock

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$104.990

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Digiode

USA . 1,059 parts In-Stock

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$105.488

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Vyrian

USA . 3,077 parts In-Stock

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3,077

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Chip Stock

USA . 355 parts In-Stock

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Classic Components Corporation

USA . 3 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 256 parts In-Stock

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$15.965

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$15.965

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Parana Technologies

USA . 925 parts In-Stock

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$45.850

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$45.850

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ChromeModa Solutions

Germany . 5,612 parts In-Stock

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$51.517

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$42.244

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5,612

$51.517

$42.244

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IDEA Electronic Components Group

UK . 1,259 parts In-Stock

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$51.517

100+ parts

$48.941

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$46.365

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1,259

$51.517

$48.941

$46.365

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Ampacity Inc.

Singapore . 71 parts In-Stock

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$94.380

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$94.380

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Corphita

USA . 3,978 parts In-Stock

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$99.936

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Component Stockers USA

USA . 34 parts In-Stock

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$103.770

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Lixinc

USA . 17,202 parts In-Stock

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DigiPath Technology Company

USA . 349 parts In-Stock

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$46.448

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349

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$46.448

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Overview

Unleash the power of cutting-edge technology with the TMS320C6412AZNZ7 by Texas Instruments, a top-of-the-line Digital Signal Processor that guarantees unmatched performance and reliability. With a reputation for excellence and innovation in the industry, Texas Instruments delivers a product that exceeds expectations. Ideal for a wide range of applications, this DSP offers seamless integration and superior functionality. Experience the value and benefits of this high-quality product, providing customers with a competitive edge like never before. Elevate your projects with the TMS320C6412AZNZ7 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness.

Integrated Cache: YES

Having an integrated cache helps in improving the processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.44 V

The high maximum supply voltage allows for flexibility in operating conditions.

Address Bus Width: 23

A wider address bus allows for handling larger amounts of memory, increasing the capabilities of the DSP.

Bit Size: 32

A 32-bit architecture enables faster and more efficient processing of data.

Power Supplies (V): 1.4,3.3

Support for multiple power supply voltages offers flexibility in different applications.

No. of Terminals: 548

Having a large number of terminals allows for connectivity with various external components.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures reliability in a variety of environments.

RAM Words: 262144

A large RAM capacity enables handling of complex algorithms and data processing tasks.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This versatile IC type makes the DSP suitable for a wide range of applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6412AZNZ7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6412AZNZ7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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