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TMS320C6412AGDK7

Texas Instruments

TMS320C6412AGDK7 by Texas Instruments

TMS320C6412AGDK7 by Texas Instruments is a 32-bit DSP with integrated cache, 64 external data bus width, and max clock frequency of 75.19 MHz. Ideal for digital signal processing applications requiring high-speed performance in a compact package with low power mode support.

Median Price

$118.626

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 35 parts In-Stock

1+ parts

$107.290

100+ parts

$98.985

1k+ parts

-

10k+ parts

-

35

$107.290

$98.985

-

-

Texas Instruments

USA . 1,640 parts In-Stock

1+ parts

$122.322

100+ parts

$108.731

1k+ parts

$79.949

10k+ parts

-

1,640

$122.322

$108.731

$79.949

-

Rochester

USA . 748 parts In-Stock

1+ parts

-

100+ parts

$114.930

1k+ parts

$102.830

10k+ parts

$96.780

748

-

$114.930

$102.830

$96.780

Verical

USA . 358 parts In-Stock

1+ parts

-

100+ parts

$143.662

1k+ parts

$128.537

10k+ parts

$120.975

358

-

$143.662

$128.537

$120.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey Marketplace

USA . 860 parts In-Stock

1+ parts

$104.990

100+ parts

-

1k+ parts

-

10k+ parts

-

860

$104.990

-

-

-

Digiode

USA . 1,549 parts In-Stock

1+ parts

$105.488

100+ parts

-

1k+ parts

-

10k+ parts

-

1,549

$105.488

-

-

-

Vyrian

USA . 4,890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,890

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 4,908 parts In-Stock

1+ parts

$44.556

100+ parts

-

1k+ parts

-

10k+ parts

-

4,908

$44.556

-

-

-

Parana Technologies

USA . 1,823 parts In-Stock

1+ parts

$64.121

100+ parts

-

1k+ parts

-

10k+ parts

-

1,823

$64.121

-

-

-

DigiPath Technology Company

USA . 1,601 parts In-Stock

1+ parts

$70.605

100+ parts

$64.957

1k+ parts

-

10k+ parts

-

1,601

$70.605

$64.957

-

-

IDEA Electronic Components Group

UK . 1,470 parts In-Stock

1+ parts

$72.046

100+ parts

$68.444

1k+ parts

$64.841

10k+ parts

-

1,470

$72.046

$68.444

$64.841

-

ChromeModa Solutions

Germany . 1,466 parts In-Stock

1+ parts

$72.046

100+ parts

$59.078

1k+ parts

-

10k+ parts

-

1,466

$72.046

$59.078

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-

Corphita

USA . 1,987 parts In-Stock

1+ parts

$99.936

100+ parts

-

1k+ parts

-

10k+ parts

-

1,987

$99.936

-

-

-

Microchip USA

USA . 2,782 parts In-Stock

1+ parts

$121.260

100+ parts

$118.030

1k+ parts

$116.410

10k+ parts

$114.800

2,782

$121.260

$118.030

$116.410

$114.800

Overview

Experience the power of cutting-edge technology with the TMS320C6412AGDK7 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) that provide unparalleled performance and reliability. With integrated cache and multiple power supplies, this DSP offers customers a versatile solution for a wide range of applications. From audio processing to telecommunications, the TMS320C6412AGDK7 is designed to meet your needs with precision and efficiency. Upgrade your projects today with Texas Instruments and discover the advantages of superior quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and affordable for customers.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the digital signal processor.

Surface Mount: YES

Surface mount technology allows for compact design and easy installation on circuit boards.

Maximum Supply Voltage: 1.44 V

Operating within a safe voltage range ensures the longevity and reliability of the digital signal processor.

Address Bus Width: 23

A wider address bus allows for increased memory capacity and faster data access.

Bit Size: 32

A 32-bit architecture provides higher computational power and precision for processing digital signals.

Power Supplies (V): 1.4,3.3

Support for different power supply voltages gives flexibility in various application scenarios.

No. of Terminals: 548

Having a large number of terminals allows for multiple connections and interfaces for peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch design enable high-density packaging and efficient heat dissipation.

Minimum Supply Voltage: 1.36 V

Operating at a low minimum supply voltage helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions.

No. of External Interrupts: 4

Supporting multiple external interrupts allows for handling time-critical events efficiently.

Minimum Operating Temperature: 0 °C

Operating at low temperatures ensures reliable performance in various operating environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and conductivity for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting on circuit boards and ensures proper connectivity.

Maximum Seated Height: 2.8 mm

A compact maximum seated height allows for slim and space-saving product designs.

RAM Words: 262144

Having a large RAM capacity enables the storage and processing of a significant amount of data.

Width: 23 mm

A compact width dimension provides flexibility in system integration and board layout.

Boundary Scan: YES

Boundary scan feature simplifies manufacturing testing and debugging processes for improved product quality.

External Data Bus Width: 64

A wider external data bus width allows for faster data transfer and processing speeds.

Maximum Clock Frequency: 75.19 MHz

With a high clock frequency, the digital signal processor can handle real-time processing tasks efficiently.

Peak Reflow Temperature °C: 220

The high peak reflow temperature tolerance ensures reliable soldering during manufacturing processes.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for optimized data flow and processing efficiency.

Length: 23 mm

A compact length dimension enables space-efficient product designs and easy integration into systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The digital signal processor with versatile peripheral ICs can support various input and output devices for diverse applications.

No. of Timers: 3

Multiple timers facilitate precise time-based operations and scheduling functions in the digital signal processor.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient signal processing.

Terminal Form: BALL

Ball terminal form enables reliable connections and easy soldering during assembly processes.

Nominal Supply Voltage: 1.4 V

Operating at a stable nominal supply voltage ensures consistent and reliable performance.

No. of DMA Channels: 64

Supporting 64 DMA channels allows for efficient data transfer and processing between different peripherals.

Terminal Pitch: 0.8 mm

A small terminal pitch supports high-density packaging and miniaturization of electronic products.

Format: FIXED POINT

The fixed-point format provides precise numerical representation and efficient arithmetic operations for signal processing tasks.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates the product has moderate sensitivity to moisture, appropriate for typical manufacturing and storage conditions.

Low Power Mode: YES

The low power mode feature allows for power-saving operation when the processing requirements are low.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6412AGDK7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6412AGDK7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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