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TMS320C6211BZFN167

Texas Instruments

TMS320C6211BZFN167 by Texas Instruments

TMS320C6211BZFN167 by Texas Instruments is a 32-bit DSP with integrated cache, operating at 167 MHz. It features 22-bit address bus width and 4096 RAM words. Ideal for digital signal processing applications requiring low power consumption and high-speed data processing capabilities.

Median Price

$46.468

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,200 parts In-Stock

1+ parts

$46.468

100+ parts

$41.305

1k+ parts

$30.371

10k+ parts

-

1,200

$46.468

$41.305

$30.371

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,599 parts In-Stock

1+ parts

$44.145

100+ parts

-

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-

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3,599

$44.145

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Vyrian

USA . 5,659 parts In-Stock

1+ parts

-

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-

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5,659

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Distributors (Availability)

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AZTECH Wire

Italy . 992 parts In-Stock

1+ parts

$20.180

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-

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992

$20.180

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-

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Parana Technologies

USA . 1,221 parts In-Stock

1+ parts

$26.241

100+ parts

-

1k+ parts

$26.834

10k+ parts

-

1,221

$26.241

-

$26.834

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DigiPath Technology Company

USA . 569 parts In-Stock

1+ parts

$28.894

100+ parts

$26.583

1k+ parts

-

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-

569

$28.894

$26.583

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-

ChromeModa Solutions

Germany . 1,561 parts In-Stock

1+ parts

$29.484

100+ parts

$24.177

1k+ parts

-

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1,561

$29.484

$24.177

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IDEA Electronic Components Group

UK . 346 parts In-Stock

1+ parts

$29.484

100+ parts

$28.010

1k+ parts

$26.536

10k+ parts

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346

$29.484

$28.010

$26.536

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Corohmni

South Africa . 1,925 parts In-Stock

1+ parts

$31.651

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1,925

$31.651

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Corphita

USA . 1,254 parts In-Stock

1+ parts

$41.821

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1,254

$41.821

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Ampacity Inc.

Singapore . 728 parts In-Stock

1+ parts

$85.970

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728

$85.970

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Microchip USA

USA . 1,443 parts In-Stock

1+ parts

$105.830

100+ parts

$103.990

1k+ parts

$103.070

10k+ parts

$102.150

1,443

$105.830

$103.990

$103.070

$102.150

QUARKTWIN TECHNOLOGY LTD

USA . 18,734 parts In-Stock

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18,734

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Kepictronics

USA . 9,000 parts In-Stock

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9,000

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A-Z Elektronik GmbH

Germany . 3,621 parts In-Stock

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3,621

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Metaverse IC Inc.

Canada . 259 parts In-Stock

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259

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Overview

Experience unparalleled performance and efficiency with the TMS320C6211BZFN167 by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers top-notch quality and reliability in their Digital Signal Processors (DSPs). This powerful processor is perfect for a wide range of applications, providing seamless operation and exceptional results. With integrated cache and low power mode, this product offers unmatched value and benefits to customers seeking cutting-edge technology. Upgrade your projects with the TMS320C6211BZFN167 and elevate your performance to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having integrated cache helps in improving processing speed by reducing memory latency, resulting in efficient performance.

Maximum Supply Voltage: 1.89 V

The higher maximum supply voltage allows for more flexibility in power supply options, making it suitable for a variety of applications.

Address Bus Width: 22

A wider address bus width enables the processor to access a larger memory space, enhancing its capability to handle complex algorithms and data processing tasks.

Bit Size: 32

A 32-bit architecture supports high computational accuracy and efficiency, making it a suitable choice for demanding signal processing tasks.

Power Supplies (V): 1.8, 3.3

Support for multiple power supply voltages allows for optimized power consumption and performance trade-offs based on specific application requirements.

No. of Terminals: 256

Having a high number of terminals provides ample connectivity options for interfacing with other components and peripherals in a system.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the processor can withstand elevated environmental conditions, ensuring reliable operation in various settings.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range allows the processor to function effectively even in challenging low-temperature environments.

Maximum Clock Frequency: 167 MHz

A high maximum clock frequency facilitates fast data processing and execution of instructions, enhancing the overall performance of the processor.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6211BZFN167 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

167 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

256

No. of Timers:

2

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

4096

Maximum Seated Height:

2.32 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6211BZFN167 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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