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TMS320C6211BGFN150

Texas Instruments

TMS320C6211BGFN150 by Texas Instruments

TMS320C6211BGFN150 by Texas Instruments is a 32-bit DSP with integrated cache, operating at max 150 MHz. Ideal for digital signal processing applications, it features 22-bit address bus width and 32-bit external data bus width. Suitable for low power mode operation with supply voltage range of 1.71V to 3.3V.

Median Price

$33.187

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 320 parts In-Stock

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$37.174

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$33.044

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$24.297

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320

$37.174

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$24.297

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Chip1Stop

Japan . 40 parts In-Stock

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$29.200

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NAC Semi

USA . 75 parts In-Stock

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$25.000

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$25.000

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Digiode

USA . 1,004 parts In-Stock

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Vyrian

USA . 4,052 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 127 parts In-Stock

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Bristol Electronics

USA . 29 parts In-Stock

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QIE Inc.

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ComSIT Distribution GmbH

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LWI Electronics Inc

India . 1 parts In-Stock

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Cyclops Electronics Ltd

UK . 1 parts In-Stock

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AZTECH Wire

Italy . 937 parts In-Stock

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$15.910

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Ampacity Inc.

Singapore . 65 parts In-Stock

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$24.820

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$24.820

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Parana Technologies

USA . 223 parts In-Stock

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$25.418

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$26.045

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$25.418

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DigiPath Technology Company

USA . 585 parts In-Stock

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$27.989

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$25.750

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$27.989

$25.750

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ChromeModa Solutions

Germany . 2,309 parts In-Stock

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$28.560

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$23.419

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$23.419

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IDEA Electronic Components Group

UK . 791 parts In-Stock

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$28.560

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$27.132

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$25.704

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$28.560

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Corphita

USA . 1,477 parts In-Stock

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$33.457

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Corohmni

South Africa . 2,086 parts In-Stock

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$58.486

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A-Z Elektronik GmbH

Germany . 6,675 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

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Kepictronics

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Perfect Parts

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XScomponents

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ChipTracer

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Overview

Experience top-of-the-line performance with the TMS320C6211BGFN150 by Texas Instruments, a leading manufacturer in the industry. This digital signal processor is perfect for a wide range of applications, offering unparalleled value and benefits to customers. With integrated cache and low power mode, this product delivers exceptional speed and efficiency. Trust Texas Instruments for quality products that set the standard for excellence in the market. Elevate your projects with the TMS320C6211BGFN150 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring a longer lifespan.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data, reducing the need to fetch data from external memory.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and facilitating assembly processes.

Maximum Supply Voltage: 1.89 V

Operates efficiently within a specified voltage range, ensuring optimal performance while preventing damage from overvoltage.

Address Bus Width: 22

Supports a large memory address space, enabling the DSP to access and process a wide range of data.

Package Shape: SQUARE

Facilitates uniform distribution of heat and efficient integration into circuit layouts.

Bit Size: 32

Enables the DSP to process data in larger chunks, enhancing speed and performance.

Power Supplies (V): 1.8,3.3

Provides flexibility in power requirements, allowing for compatibility with different systems and voltage standards.

No. of Terminals: 256

Ensures connectivity with a wide range of external devices and components for data exchange and processing.

Package Style (Meter): GRID ARRAY

Facilitates easy mounting on PCBs and ensures secure connections for efficient signal processing.

Minimum Supply Voltage: 1.71 V

Ensures stable operation even under low voltage conditions, maintaining performance and reliability.

Maximum Operating Temperature: 90 °C

Supports operation in high-temperature environments, expanding the range of applications for the DSP.

No. of External Interrupts: 4

Allows the DSP to quickly respond to external events, improving real-time processing capabilities.

Minimum Operating Temperature: 0 °C

Ensures the DSP can operate in a wide range of temperature conditions without compromising performance.

Terminal Finish: TIN LEAD

Provides reliable electrical connections and prevents oxidation, ensuring consistent performance over time.

Terminal Position: BOTTOM

Facilitates easy installation and maintenance of the DSP on circuit boards while optimizing signal routing.

Maximum Seated Height: 2.32 mm

Allows for compact design and integration of the DSP into tight spaces within electronic devices.

RAM Words: 4096

Provides ample memory for processing and storing data, enhancing the DSP's capabilities for complex algorithms.

Width: 27 mm

Compact size enables easy integration into various electronic devices without sacrificing performance.

Boundary Scan: YES

Facilitates debugging and testing of the DSP and connected components, ensuring quality and reliability.

External Data Bus Width: 32

Allows for high-speed data transfer between the DSP and external devices, improving overall system performance.

Maximum Clock Frequency: 150 MHz

Enables fast processing and execution of instructions, enhancing the overall performance of the DSP.

Maximum Time At Peak Reflow Temperature (s): 20

Supports efficient and reliable soldering processes during manufacturing, ensuring the integrity of connections.

Peak Reflow Temperature °C: 220

Withstands high-temperature reflow processes, essential for soldering the DSP to circuit boards.

Internal Bus Architecture: MULTIPLE

Enhances data transfer speed between different components within the DSP, optimizing overall performance.

Length: 27 mm

Compact size allows for space-saving integration into electronic devices, without compromising functionality.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports versatile applications in various electronic systems, providing flexibility and adaptability.

No. of Timers: 2

Facilitates time-sensitive operations and scheduling tasks within the DSP, enhancing its functionality in real-time applications.

Technology: CMOS

Low power consumption and high noise immunity, ensuring efficient operation and performance optimization.

Terminal Form: BALL

Ensures secure and reliable connections with other components and circuit board, preventing signal loss or disruptions.

Nominal Supply Voltage: 1.8 V

Stable voltage supply for consistent performance and reliability in various operating conditions.

No. of DMA Channels: 16

Enables efficient data transfer between peripherals and memory, enhancing the DSP's processing capabilities.

Terminal Pitch: 1.27 mm

Facilitates easy mounting and soldering of the DSP on circuit boards, ensuring reliable connections and signal integrity.

Format: FIXED POINT

Specialized format for signal processing tasks, providing accurate and efficient computation for specific applications.

Moisture Sensitivity Level (MSL): 4

Ensures the DSP's reliability and performance under varying humidity conditions, extending its operational lifespan.

Low Power Mode: YES

Enables power-saving features for energy-efficient operation, ideal for battery-powered devices and reducing overall energy consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6211BGFN150 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

256

No. of Timers:

2

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

4096

Maximum Seated Height:

2.32 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6211BGFN150 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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