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TMS320C6205ZHK200

Texas Instruments

TMS320C6205ZHK200 by Texas Instruments

TMS320C6205ZHK200 by Texas Instruments is a 32-bit DSP with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 200 MHz, making it ideal for applications requiring high-speed signal processing such as audio and video processing. With low power mode and multiple internal bus architecture, it offers efficient performance in compact designs.

Median Price

$5.970

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Tomark Electronics Ltd

UK . 40 parts In-Stock

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$5.970

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Vyrian

USA . 6,999 parts In-Stock

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Digiode

USA . 1,154 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 54 parts In-Stock

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ComSIT Distribution GmbH

Germany . 30 parts In-Stock

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Bristol Electronics

USA . 29 parts In-Stock

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Dan-Mar Components

USA . 29 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,406 parts In-Stock

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$8.000

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Ampacity Inc.

Singapore . 932 parts In-Stock

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$9.000

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AZTECH Wire

Italy . 793 parts In-Stock

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$12.487

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Parana Technologies

USA . 1,515 parts In-Stock

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$62.120

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Corohmni

South Africa . 101 parts In-Stock

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ChromeModa Solutions

Germany . 6,159 parts In-Stock

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$69.798

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$57.234

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IDEA Electronic Components Group

UK . 1,978 parts In-Stock

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$69.798

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$66.308

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$62.818

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Microchip USA

USA . 4,175 parts In-Stock

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Corphita

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QUARKTWIN TECHNOLOGY LTD

USA . 2,946 parts In-Stock

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DigiPath Technology Company

USA . 2,323 parts In-Stock

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$62.930

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Overview

Experience the power of cutting-edge technology with the TMS320C6205ZHK200 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-quality products that set new standards in performance and reliability. The TMS320C6205ZHK200 is perfect for a wide range of applications, from telecommunications to audio processing, offering unparalleled speed and efficiency. Take your projects to the next level with this high-performance DSP, designed to meet your needs and exceed your expectations. Elevate your work with Texas Instruments and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product easy to handle and resistant to damage during handling and shipping.

Integrated Cache: YES

Integrated cache helps in speeding up data access and processing, improving overall performance of the DSP.

Maximum Supply Voltage: 1.57 V

Higher maximum supply voltage allows for reliable operation and flexibility in power supply options.

Address Bus Width: 32

With a wide address bus width of 32, the DSP can access a large range of memory locations, enhancing its processing capabilities.

Bit Size: 32

A 32-bit architecture enables the DSP to handle complex calculations and data processing efficiently.

Power Supplies (V): 1.5, 3.3, 5

Support for multiple power supply voltages allows for compatibility with various systems and power sources.

No. of Terminals: 288

Having 288 terminals provides ample connectivity options for interfacing with other components and peripherals.

Maximum Operating Temperature: 90 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in a wide range of temperature conditions without compromising performance.

Maximum Clock Frequency: 200 MHz

With a high maximum clock frequency, the DSP can execute instructions quickly, leading to faster data processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6205ZHK200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3,5

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6205ZHK200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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