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TMS320C6205DZHK200

Texas Instruments

TMS320C6205DZHK200 by Texas Instruments

TMS320C6205DZHK200 by Texas Instruments is a 32-bit DSP with integrated cache, 32-bit external data bus width, and max clock frequency of 200 MHz. Ideal for digital signal processing applications requiring low power consumption and high-speed performance in a compact package.

Median Price

$14.825

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35 parts In-Stock

1+ parts

$12.550

100+ parts

$12.300

1k+ parts

$12.050

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35

$12.550

$12.300

$12.050

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Avnet

USA . 537 parts In-Stock

1+ parts

-

100+ parts

$17.100

1k+ parts

$15.357

10k+ parts

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537

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$17.100

$15.357

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Distributors (In-Stock)

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DF Sales Co.

USA . 4 parts In-Stock

1+ parts

$62.500

100+ parts

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4

$62.500

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DF Sales Co.

USA . 4 parts In-Stock

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$62.500

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4

$62.500

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Vyrian

USA . 7,998 parts In-Stock

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7,998

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Digiode

USA . 2,101 parts In-Stock

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2,101

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Chip Stock

USA . 173 parts In-Stock

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Electronics Depot

USA . 23 parts In-Stock

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 819 parts In-Stock

1+ parts

$5.578

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-

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819

$5.578

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One Stop Electronics

USA . 224 parts In-Stock

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$24.000

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224

$24.000

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Parana Technologies

USA . 891 parts In-Stock

1+ parts

$32.598

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$108.793

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891

$32.598

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$108.793

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ChromeModa Solutions

Germany . 6,258 parts In-Stock

1+ parts

$36.627

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$30.034

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6,258

$36.627

$30.034

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IDEA Electronic Components Group

UK . 1,117 parts In-Stock

1+ parts

$36.627

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$34.796

1k+ parts

$32.964

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1,117

$36.627

$34.796

$32.964

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Advanced Electronics

New Zealand . 61 parts In-Stock

1+ parts

$38.430

100+ parts

$34.971

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$31.513

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61

$38.430

$34.971

$31.513

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Corohmni

South Africa . 5,086 parts In-Stock

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$62.397

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A-Z Elektronik GmbH

Germany . 5,150 parts In-Stock

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Corphita

USA . 4,597 parts In-Stock

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DigiPath Technology Company

USA . 112 parts In-Stock

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$33.023

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112

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Microchip USA

USA . 101 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the TMS320C6205DZHK200 from Texas Instruments, a leading manufacturer in the industry. As a top-of-the-line Digital Signal Processor (DSP), this product offers integrated cache, high-speed processing capabilities, and a wide range of applications in industries such as telecommunications, audio processing, and industrial automation. With its advanced features and reliable design, the TMS320C6205DZHK200 delivers exceptional value, benefits, and advantages to customers seeking cutting-edge solutions for their projects. Elevate your performance with this quality product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and protects the internal components of the DSP from external elements, making it suitable for various environments.

Integrated Cache: YES

Integrated cache allows for faster access to frequently used data and instructions, enhancing the overall performance and efficiency of the DSP.

Maximum Supply Voltage: 1.57 V

Having a high maximum supply voltage ensures stable operation and prevents any damage to the DSP under varying voltage conditions.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient data processing and storage, enabling the DSP to handle complex algorithms and calculations effectively.

Address Bus Width: 32

With a wide address bus width, the DSP can access a large memory space, facilitating seamless data transfer and retrieval during processing tasks.

Power Supplies (V): 1.5, 3.3, 5

Supporting multiple power supply voltages provides flexibility in system design and compatibility with different power sources, ensuring reliable operation in various applications.

No. of Terminals: 288

Having a high number of terminals allows for greater connectivity options and integration with other components, enhancing the versatility and functionality of the DSP.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The unique package style design with a grid array, low profile, and fine pitch offers space-saving benefits, making it suitable for compact electronic devices and applications with limited space constraints.

RAM Words: 16384

With a large RAM capacity, the DSP can efficiently store and access a significant amount of data, enabling seamless multitasking and processing of complex algorithms.

Maximum Clock Frequency: 200 MHz

A high maximum clock frequency allows the DSP to operate at high speeds, resulting in faster data processing and real-time responsiveness, making it ideal for time-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6205DZHK200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3,5

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6205DZHK200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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