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TMS320C6203BZNZ173

Texas Instruments

TMS320C6203BZNZ173 by Texas Instruments

TMS320C6203BZNZ173 by Texas Instruments is a 32-bit DSP with 300 MHz clock frequency, 131072 RAM words, and 22-bit address bus width. Ideal for digital signal processing applications due to its low power mode, CMOS technology, and boundary scan feature.

Median Price

$87.762

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 682 parts In-Stock

1+ parts

-

100+ parts

$78.010

1k+ parts

$69.800

10k+ parts

$65.700

682

-

$78.010

$69.800

$65.700

DigiKey

USA . 682 parts In-Stock

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682

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Verical

USA . 682 parts In-Stock

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100+ parts

$97.513

1k+ parts

$87.250

10k+ parts

$82.125

682

-

$97.513

$87.250

$82.125

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,551 parts In-Stock

1+ parts

$82.336

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1,551

$82.336

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DigiKey Marketplace

USA . 682 parts In-Stock

1+ parts

$90.140

100+ parts

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682

$90.140

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Vyrian

USA . 2,678 parts In-Stock

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2,678

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 171 parts In-Stock

1+ parts

$49.438

100+ parts

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171

$49.438

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DigiPath Technology Company

USA . 338 parts In-Stock

1+ parts

$54.437

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338

$54.437

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IDEA Electronic Components Group

UK . 1,571 parts In-Stock

1+ parts

$55.548

100+ parts

$52.771

1k+ parts

$49.993

10k+ parts

-

1,571

$55.548

$52.771

$49.993

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ChromeModa Solutions

Germany . 288 parts In-Stock

1+ parts

$55.548

100+ parts

$45.549

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288

$55.548

$45.549

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Corohmni

South Africa . 151 parts In-Stock

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$69.247

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151

$69.247

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Corphita

USA . 3,664 parts In-Stock

1+ parts

$78.003

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3,664

$78.003

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Overview

Get ready to experience unparalleled performance and efficiency with the TMS320C6203BZNZ173 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality digital signal processors that are ideal for a wide range of applications. From audio processing to telecommunications, this DSP offers exceptional value, benefits, and advantages to customers. With a powerful 32-bit architecture and maximum clock frequency of 300 MHz, the TMS320C6203BZNZ173 is sure to exceed your expectations. Upgrade your projects today with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for portable devices.

Maximum Supply Voltage: 1.57 V

The low maximum supply voltage requirement allows for efficient power usage and extends battery life in battery-operated devices.

RAM Words: 131072

With a large RAM capacity of 131072 words, the product can handle complex signal processing tasks efficiently and effectively.

Maximum Clock Frequency: 300 MHz

The high maximum clock frequency of 300 MHz enables fast signal processing and performance, making it suitable for real-time applications.

Technology: CMOS

Being based on CMOS technology, the product offers high speed, low power consumption, and compatibility with various digital systems.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6203BZNZ173 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

352

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA352,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.7,3.3

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6203BZNZ173 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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