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TMS320C6202GJLA233

Texas Instruments

TMS320C6202GJLA233 by Texas Instruments

TMS320C6202GJLA233 by Texas Instruments is a 32-bit DSP with 233 MHz clock frequency, 32768 RAM words, and 22-bit address bus width. Ideal for industrial applications requiring high-speed processing, it features low power mode and integrated cache for efficient data handling in digital signal processing tasks.

Median Price

$247.340

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 181 parts In-Stock

1+ parts

$209.230

100+ parts

$196.680

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$184.120

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181

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$184.120

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DigiKey

USA . 181 parts In-Stock

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Verical

USA . 106 parts In-Stock

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$285.450

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$258.125

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106

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$285.450

$258.125

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Distributors (In-Stock)

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DigiKey Marketplace

USA . 181 parts In-Stock

1+ parts

$229.700

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181

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Digiode

USA . 52 parts In-Stock

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$230.793

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Vyrian

USA . 3,523 parts In-Stock

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Electronic Expediters

USA . 5 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 5,160 parts In-Stock

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$29.397

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$29.397

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Parana Technologies

USA . 1,934 parts In-Stock

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$70.685

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$70.685

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DigiPath Technology Company

USA . 2,117 parts In-Stock

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$77.833

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$71.606

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$77.833

$71.606

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ChromeModa Solutions

Germany . 6,844 parts In-Stock

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$79.421

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$65.125

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6,844

$79.421

$65.125

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IDEA Electronic Components Group

UK . 799 parts In-Stock

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$79.421

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$75.450

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$71.479

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799

$79.421

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$71.479

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Corphita

USA . 1,865 parts In-Stock

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$218.646

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$218.646

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Microchip USA

USA . 221 parts In-Stock

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$257.730

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$250.860

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$247.420

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$243.990

221

$257.730

$250.860

$247.420

$243.990

QUARKTWIN TECHNOLOGY LTD

USA . 5,917 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Perfect Parts

USA . 90 parts In-Stock

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Overview

Unlock the power of cutting-edge digital signal processing with the TMS320C6202GJLA233 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. The TMS320C6202GJLA233 belongs to the category of Digital Signal Processors (DSPs), offering integrated cache and surface mount capabilities, making it ideal for a wide range of applications. Experience superior performance and efficiency with this product, providing you with unmatched value and benefits that will elevate your projects to new heights. Choose Texas Instruments for innovation you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the DSP, ensuring a longer lifespan.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data, reducing the need to fetch data from external memory.

Maximum Supply Voltage: 1.89 V

Allows for efficient power usage while ensuring optimal performance.

Address Bus Width: 22

Enables the DSP to access a large memory address space, crucial for handling complex algorithms and data processing tasks.

Bit Size: 32

Utilizes a 32-bit architecture for enhanced processing capabilities and efficiency.

Maximum Operating Temperature: 105 °C

Designed to operate reliably in high-temperature environments, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6202GJLA233 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

233 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

352

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA352,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

3.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6202GJLA233 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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