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TMS320C6201GJL200

Texas Instruments

TMS320C6201GJL200 by Texas Instruments

TMS320C6201GJL200 by Texas Instruments is a 32-bit DSP with 22-bit address bus, operating at max 200 MHz. Ideal for digital signal processing applications, it features low power mode, 16384 RAM words, and boundary scan capability.

Median Price

$105.938

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 66 parts In-Stock

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66

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Rochester

USA . 45 parts In-Stock

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-

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$91.900

1k+ parts

$82.230

10k+ parts

$77.390

45

-

$91.900

$82.230

$77.390

Verical

USA . 11 parts In-Stock

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-

100+ parts

$119.975

1k+ parts

$108.487

10k+ parts

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11

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$119.975

$108.487

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Distributors (In-Stock)

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Digiode

USA . 2,416 parts In-Stock

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$97.004

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DigiKey Marketplace

USA . 91 parts In-Stock

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$106.190

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91

$106.190

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LIBRA Elektronik GmbH

Germany . 10,666 parts In-Stock

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Vyrian

USA . 5,032 parts In-Stock

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Electronics Depot

USA . 429 parts In-Stock

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429

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Bristol Electronics

USA . 32 parts In-Stock

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32

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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Kronex Distribution GmbH

USA . 5 parts In-Stock

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LWI Electronics Inc

India . 1 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,727 parts In-Stock

1+ parts

$17.566

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$17.765

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1,727

$17.566

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$17.765

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Corohmni

South Africa . 154 parts In-Stock

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$18.143

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$18.143

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ChromeModa Solutions

Germany . 2,787 parts In-Stock

1+ parts

$19.737

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$16.184

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2,787

$19.737

$16.184

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IDEA Electronic Components Group

UK . 1,961 parts In-Stock

1+ parts

$19.737

100+ parts

$18.750

1k+ parts

$17.763

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1,961

$19.737

$18.750

$17.763

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Ampacity Inc.

Singapore . 41 parts In-Stock

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$86.790

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41

$86.790

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Corphita

USA . 4,679 parts In-Stock

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$91.899

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4,679

$91.899

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DigiPath Technology Company

USA . 585 parts In-Stock

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$17.795

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585

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$17.795

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Microchip USA

USA . 277 parts In-Stock

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Kepictronics

USA . 80 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS320C6201GJL200 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unmatched quality and reliability. The TMS320C6201GJL200 offers unparalleled performance in a wide range of applications, from audio and telecommunications to industrial control systems. With its advanced features and innovative design, this DSP provides exceptional value and benefits to customers seeking high-speed processing capabilities. Stay ahead of the competition with the TMS320C6201GJL200 and unleash the full potential of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 1.89 V

The low maximum supply voltage helps in reducing power consumption and ensures efficient operation.

Address Bus Width: 22

A wider address bus width allows the processor to access a larger memory space, improving overall performance.

Bit Size: 32

A 32-bit architecture provides enhanced processing capabilities, making the product suitable for complex signal processing tasks.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for flexibility in different operating environments and power management strategies.

No. of Terminals: 352

The high number of terminals provides ample connectivity options for interfacing with external components and peripherals.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures reliable performance in a variety of environments, making the product versatile and durable.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature indicates the product's ability to function in cold environments without any issues.

RAM Words: 16384

With a large number of RAM words, the processor can efficiently store and access data during signal processing tasks.

Maximum Clock Frequency: 200 MHz

The high maximum clock frequency enables fast data processing and real-time signal computation, making the product suitable for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, enhancing the overall efficiency of the product.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6201GJL200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

352

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA352,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6201GJL200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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