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TMS320C5545AZQW10

Texas Instruments

TMS320C5545AZQW10 by Texas Instruments

TMS320C5545AZQW10 by Texas Instruments is a DSP with max clock freq of 12MHz, operating temp range -10 to 70°C, and low power mode. Ideal for applications requiring fixed point format, such as digital signal processing in commercial-grade devices.

Median Price

$4.280

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

$4.280

100+ parts

$4.190

1k+ parts

$4.110

10k+ parts

-

2,500

$4.280

$4.190

$4.110

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,864 parts In-Stock

1+ parts

$4.066

100+ parts

-

1k+ parts

-

10k+ parts

-

3,864

$4.066

-

-

-

Vyrian

USA . 2,918 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,918

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,343 parts In-Stock

1+ parts

$3.640

100+ parts

-

1k+ parts

-

10k+ parts

-

2,343

$3.640

-

-

-

Corphita

USA . 2,660 parts In-Stock

1+ parts

$3.852

100+ parts

-

1k+ parts

-

10k+ parts

-

2,660

$3.852

-

-

-

AZTECH Wire

Italy . 936 parts In-Stock

1+ parts

$12.350

100+ parts

-

1k+ parts

-

10k+ parts

-

936

$12.350

-

-

-

Parana Technologies

USA . 298 parts In-Stock

1+ parts

$39.363

100+ parts

-

1k+ parts

-

10k+ parts

-

298

$39.363

-

-

-

ChromeModa Solutions

Germany . 3,051 parts In-Stock

1+ parts

$44.228

100+ parts

$36.267

1k+ parts

-

10k+ parts

-

3,051

$44.228

$36.267

-

-

IDEA Electronic Components Group

UK . 2,345 parts In-Stock

1+ parts

$44.228

100+ parts

$42.017

1k+ parts

$39.805

10k+ parts

-

2,345

$44.228

$42.017

$39.805

-

Corohmni

South Africa . 2,455 parts In-Stock

1+ parts

$57.819

100+ parts

-

1k+ parts

-

10k+ parts

-

2,455

$57.819

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

DigiPath Technology Company

USA . 942 parts In-Stock

1+ parts

-

100+ parts

$39.876

1k+ parts

-

10k+ parts

-

942

-

$39.876

-

-

Microchip USA

USA . 114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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114

-

-

-

-

Overview

Experience the next level of digital signal processing with the TMS320C5545AZQW10 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in the form of the TMS320C5545AZQW10. This digital signal processor is perfect for a wide range of applications, offering unmatched performance and efficiency. Unlock the full potential of your projects with the TMS320C5545AZQW10 and elevate your work to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and lightweight, making it suitable for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and quick installation on circuit boards, saving time during production.

Maximum Supply Voltage: 1.43 V

A higher maximum supply voltage allows for flexibility in the power source options for the device.

Package Shape: SQUARE

Square package shape helps in optimizing space on the circuit board, allowing for efficient layout design.

No. of Terminals: 118

Having a high number of terminals enables the DSP to connect with multiple components for advanced signal processing capabilities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style enhances the overall performance of the DSP by providing a compact and high-density design for better signal processing efficiency.

Minimum Supply Voltage: 1.24 V

Lower minimum supply voltage helps in reducing power consumption and improving energy efficiency of the device.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: -10 °C

Low minimum operating temperature allows the DSP to function effectively in various temperature ranges, making it versatile for different applications.

Terminal Finish: TIN SILVER COPPER

Terminal finish of Tin Silver Copper offers good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure placement of the DSP on the circuit board.

Maximum Seated Height: 1 mm

Low maximum seated height reduces the overall profile of the device, making it suitable for slim electronic devices.

Width: 7 mm

Compact width size allows for efficient utilization of space on the circuit board.

Boundary Scan: YES

Boundary scan feature enables efficient testing and debugging of the DSP during production and maintenance phases.

Maximum Clock Frequency: 12 MHz

High maximum clock frequency enables fast processing of signals for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature helps in preventing damage to the DSP during soldering process.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and secure attachment of the DSP to the circuit board.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances the data transfer speed within the DSP for efficient signal processing.

Length: 7 mm

Compact length size contributes to the overall small form factor of the device, suitable for space-constrained applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the DSP is designed for standard operating conditions in commercial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Peripheral IC type ensures that the DSP is specifically designed for digital signal processing applications, providing high performance in signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high integration for efficient signal processing capabilities.

Terminal Form: BALL

Ball terminal form provides good contact reliability and ease of installation on the circuit board.

Nominal Supply Voltage: 1.3 V

Stable nominal supply voltage ensures consistent and reliable performance of the device.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for high-density packaging of the DSP on the circuit board, optimizing space usage.

Format: FIXED POINT

Fixed-point format is suitable for applications where precision and accuracy in signal processing are essential.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the DSP has moderate sensitivity to moisture, requiring standard handling procedures during production and storage.

Low Power Mode: YES

Low power mode feature allows for power-efficient operation of the DSP, extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5545AZQW10 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B118

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

118

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.24 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

TMS320C5545AZQW10 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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