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TMS320C5535AZHHA05

Texas Instruments

TMS320C5535AZHHA05 by Texas Instruments

TMS320C5535AZHHA05 by Texas Instruments is a 16-bit DSP with 163840 RAM words, operating at max 12 MHz. Ideal for industrial applications, it features 1.05V nominal voltage and boundary scan capability. With low power mode and multiple internal bus architecture, it offers versatile digital signal processing solutions.

Median Price

$4.478

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 76 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.478

10k+ parts

$4.397

76

-

-

$4.478

$4.397

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,724 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,724

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-

-

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Digiode

USA . 1,457 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,457

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,300 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,300

$8.000

-

-

-

AZTECH Wire

Italy . 801 parts In-Stock

1+ parts

$11.656

100+ parts

-

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801

$11.656

-

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Parana Technologies

USA . 1,057 parts In-Stock

1+ parts

$14.618

100+ parts

-

1k+ parts

$15.056

10k+ parts

-

1,057

$14.618

-

$15.056

-

DigiPath Technology Company

USA . 485 parts In-Stock

1+ parts

$16.096

100+ parts

-

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485

$16.096

-

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ChromeModa Solutions

Germany . 3,555 parts In-Stock

1+ parts

$16.425

100+ parts

$13.468

1k+ parts

-

10k+ parts

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3,555

$16.425

$13.468

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IDEA Electronic Components Group

UK . 1,467 parts In-Stock

1+ parts

$16.425

100+ parts

$15.604

1k+ parts

$14.782

10k+ parts

-

1,467

$16.425

$15.604

$14.782

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Corohmni

South Africa . 2,500 parts In-Stock

1+ parts

$24.116

100+ parts

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2,500

$24.116

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Corphita

USA . 4,628 parts In-Stock

1+ parts

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4,628

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Kepictronics

USA . 800 parts In-Stock

1+ parts

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800

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Microchip USA

USA . 399 parts In-Stock

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399

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Overview

Unlock unparalleled performance and efficiency with the TMS320C5535AZHHA05 by Texas Instruments. As a leading manufacturer of Digital Signal Processors (DSPs), Texas Instruments delivers cutting-edge technology that revolutionizes various applications in industries such as telecommunications, audio processing, and industrial automation. With a focus on quality and innovation, this product offers customers exceptional value through its advanced features, low power consumption, and superior processing capabilities. Experience the advantages of Texas Instruments' expertise and elevate your projects to new heights with the TMS320C5535AZHHA05.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Enables easy and secure installation on circuit boards, reducing assembly time and potential errors.

Maximum Supply Voltage: 1.15 V

Ensures safe operation and prevents damage to the DSP from voltage spikes.

On Chip Data RAM Width: 8

Allows for efficient data processing and storage, enhancing the performance of the DSP.

Package Shape: SQUARE

Facilitates uniform and compact packaging, making it easy to integrate into various electronic devices.

Bit Size: 16

Offers a good balance between processing power and efficiency for a wide range of applications.

Power Supplies (V): 1.05,1.8/3.3

Provides flexibility in power options, allowing compatibility with different voltage sources.

No. of Terminals: 144

Ensures sufficient connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY

Enhances thermal properties and enables better heat dissipation for improved performance.

Minimum Supply Voltage: 0.998 V

Ensures that the DSP can operate reliably even at low voltages, increasing its versatility.

Maximum Operating Temperature: 85 °C

Allows the DSP to function in a wide range of environments, including industrial settings.

No. of External Interrupts: 2

Enables the DSP to respond to external events promptly, enhancing its real-time processing capabilities.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme cold conditions, making the DSP suitable for various applications.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and low-resistance connection, ensuring stable performance of the DSP.

Terminal Position: BOTTOM

Facilitates easier PCB layout and routing, simplifying the overall design process.

Maximum Seated Height: 1.4 mm

Allows for a compact form factor, making it suitable for space-constrained applications.

RAM Words: 163840

Provides ample storage for data processing, enabling complex algorithms to be implemented efficiently.

Width: 12 mm

Compact size enables the DSP to be integrated into a variety of devices without taking up much space.

Boundary Scan: YES

Simplifies testing and debugging during production, ensuring high quality and reliability.

Maximum Clock Frequency: 12 MHz

Offers fast processing speed for real-time applications, delivering high performance.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly processes, reducing the risk of defects and failures.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes, ensuring reliable connections during manufacturing.

Internal Bus Architecture: MULTIPLE

Provides efficient data transfer within the DSP, enhancing overall performance and speed.

Length: 12 mm

Compact size allows for easy integration into various electronic devices without sacrificing functionality.

Temperature Grade: INDUSTRIAL

Suitable for use in harsh industrial environments, ensuring reliable operation under demanding conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Offers versatile peripheral interfaces for connecting to external devices, expanding the DSP's functionality.

No. of Timers: 4

Facilitates time-sensitive operations and event scheduling, enhancing the DSP's versatility.

Technology: CMOS

Provides low power consumption and high noise immunity, ideal for battery-powered or noise-sensitive applications.

Terminal Form: BALL

Facilitates reliable connections and soldering during assembly, ensuring robust performance.

Nominal Supply Voltage: 1.05 V

Provides a stable voltage level for optimal performance and energy efficiency.

No. of DMA Channels: 16

Enables efficient data transfer and processing, improving overall system performance.

ROM Programmability: MROM

Provides non-volatile memory for storing critical programs and data, ensuring data integrity.

Terminal Pitch: 0.8 mm

Enables compact packaging and efficient PCB layout, saving space and reducing manufacturing costs.

Format: FIXED POINT

Optimized for fixed-point arithmetic operations, ideal for applications that require fast and efficient processing.

Moisture Sensitivity Level (MSL): 3

Ensures reliability in humid environments, reducing the risk of moisture-related damage.

Low Power Mode: YES

Allows for energy-efficient operation, extending the battery life in portable devices.

On Chip Program ROM Width: 8

Provides ample storage for program code, allowing for complex algorithms to be executed efficiently.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5535AZHHA05 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

144

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA144,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05,1.8/3.3

Qualification:

Not Qualified

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320C5535AZHHA05 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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