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TMS320C5532AZHH05

Texas Instruments

TMS320C5532AZHH05 by Texas Instruments

TMS320C5532AZHH05 by Texas Instruments is a 16-bit DSP with 1.15V max supply voltage, 12MHz clock frequency, and 32768 RAM words. Ideal for digital signal processing applications due to its low power mode, multiple internal bus architecture, and 4 timers for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,968 parts In-Stock

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Digiode

USA . 1,468 parts In-Stock

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1,468

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Distributors (Availability)

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Ampacity Inc.

Singapore . 376 parts In-Stock

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$5.000

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376

$5.000

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AZTECH Wire

Italy . 796 parts In-Stock

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$16.663

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796

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One Stop Electronics

USA . 831 parts In-Stock

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$33.000

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831

$33.000

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Parana Technologies

USA . 1,878 parts In-Stock

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$36.133

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1,878

$36.133

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DigiPath Technology Company

USA . 1,246 parts In-Stock

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$39.787

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$36.604

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1,246

$39.787

$36.604

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IDEA Electronic Components Group

UK . 1,278 parts In-Stock

1+ parts

$40.599

100+ parts

$38.569

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$36.539

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1,278

$40.599

$38.569

$36.539

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ChromeModa Solutions

Germany . 801 parts In-Stock

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$40.599

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$33.291

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801

$40.599

$33.291

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Corohmni

South Africa . 404 parts In-Stock

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$67.599

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404

$67.599

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Component Stockers USA

USA . 678 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 3,587 parts In-Stock

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Corphita

USA . 1,686 parts In-Stock

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Microchip USA

USA . 115 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TMS320C5532AZHH05 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch digital signal processors like this one, perfect for a wide range of applications. Whether you're looking to enhance audio quality or improve image processing, this DSP offers exceptional value and benefits. With its advanced technology and low power mode, customers can trust that they're getting a high-quality product that will exceed their expectations. Elevate your projects with the TMS320C5532AZHH05 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Maximum Supply Voltage: 1.15 V

Allows for efficient power consumption and operation within safe voltage limits.

Bit Size: 16

Enables processing of data in larger chunks, leading to faster and more efficient performance.

No. of Terminals: 144

Provides ample connectivity options for interfacing with other devices and peripherals.

Maximum Clock Frequency: 12 MHz

Enables high-speed processing and execution of instructions for quick response times.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency, making the product suitable for portable and battery-operated devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5532AZHH05 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

144

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA144,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05,1.8/3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320C5532AZHH05 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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