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TMS320C542PGE2-40

Texas Instruments

TMS320C542PGE2-40 by Texas Instruments

TMS320C542PGE2-40 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20 MHz. Ideal for digital signal processing applications, it features low power mode, barrel shifter, and on-chip data RAM of 5120 words.

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Vyrian

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Digiode

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Bristol Electronics

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Standard Data Resources

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Resion

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AZTECH Wire

Italy . 343 parts In-Stock

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One Stop Electronics

USA . 744 parts In-Stock

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Corohmni

South Africa . 529 parts In-Stock

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Parana Technologies

USA . 341 parts In-Stock

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ChromeModa Solutions

Germany . 6,180 parts In-Stock

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IDEA Electronic Components Group

UK . 550 parts In-Stock

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DigiPath Technology Company

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Overview

Experience high-quality signal processing with the TMS320C542PGE2-40 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch digital signal processors that cater to various applications. Unlock the full potential of your projects with this advanced DSP, offering superior performance and efficiency. Benefit from its low power mode, barrel shifter, and on-chip program ROM width of 16, providing unmatched value and benefits to customers. Choose the TMS320C542PGE2-40 for cutting-edge technology and reliable results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are cost-effective and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration into circuit boards, saving space and facilitating automated assembly.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage provides flexibility in power requirements and can handle fluctuations without causing damage to the DSP.

On Chip Data RAM Width: 16

A wider data RAM width allows for faster data processing and manipulation, enhancing the performance of the DSP.

Address Bus Width: 23

A wider address bus width enables the DSP to access a larger memory space, enhancing its capability to handle complex algorithms and calculations.

Package Shape: SQUARE

The square package shape provides a symmetrical footprint, making it easier to design and lay out on a circuit board.

Bit Size: 16

The 16-bit architecture allows for efficient data processing and arithmetic operations, suitable for a wide range of signal processing tasks.

Power Supplies (V): 5

Operating at a standard 5V power supply simplifies integration and compatibility with existing systems and components.

No. of Terminals: 144

Having a higher number of terminals allows for more connectivity options and peripherals to be interfaced with the DSP.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch design offer space-saving advantages and compatibility with modern assembly techniques.

Minimum Supply Voltage: 4.75 V

The lower minimum supply voltage ensures stable operation even during power fluctuations or lower power scenarios.

No. of External Interrupts: 5

Having multiple external interrupts allows the DSP to respond to external events or priority tasks without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, maintaining signal integrity over time.

Terminal Position: QUAD

Quad terminal position offers a secure and stable connection, reducing the risk of signal loss or interference.

Maximum Seated Height: 1.6 mm

The low seated height simplifies design constraints and allows for compact and slim device profiles.

RAM Words: 5120

With a large RAM capacity, the DSP can store and process a significant amount of data, supporting complex algorithms and calculations.

Width: 20 mm

A compact width dimension makes the DSP suitable for space-constrained applications and facilitates easy integration into existing systems.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and diagnostics during manufacturing and maintenance, ensuring reliability and quality.

External Data Bus Width: 16

The 16-bit external data bus width enables high-speed data transfer between the DSP and external peripherals, improving overall system performance.

Maximum Clock Frequency: 20 MHz

Operating at a maximum clock frequency of 20 MHz provides fast data processing speed, suitable for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

The extended time at peak reflow temperature allows for reliable soldering and assembly processes, ensuring stable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature withstands harsh assembly conditions, making the DSP suitable for a variety of manufacturing environments.

Internal Bus Architecture: MULTIPLE

Having multiple internal buses enhances data flow and processing efficiency, enabling parallel operations and reducing bottlenecks.

Length: 20 mm

A compact length dimension facilitates space-efficient designs and compatibility with various mounting configurations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The versatile peripheral IC type supports a wide range of digital signal processing tasks, making the DSP suitable for diverse applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with digital systems, enhancing overall performance and efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides a reliable and robust connection, suitable for automated assembly and rugged operating conditions.

Nominal Supply Voltage: 5 V

Operating at a nominal 5V supply voltage ensures compatibility with standard power sources and simplifies system integration.

ROM Programmability: MROM

MROM programmability offers fast and reliable program execution, suitable for fixed-point signal processing applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and space-saving designs, enabling compact and efficient product layouts.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances processing speed, making the DSP suitable for real-time applications.

Low Power Mode: YES

The low power mode option enables energy-efficient operation, extending battery life and reducing power consumption in portable devices.

Barrel Shifter: YES

Having a barrel shifter capability enhances data manipulation and shifting operations, improving overall efficiency and performance.

On Chip Program ROM Width: 16

A wide on-chip program ROM width allows for efficient storage and execution of program instructions, optimizing performance and speed.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C542PGE2-40 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

5120

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320C542PGE2-40 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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