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TMS320C44GFW50

Texas Instruments

TMS320C44GFW50 by Texas Instruments

TMS320C44GFW50 by Texas Instruments is a 32-bit DSP with 24-bit address bus, 32-bit external data bus, and 50 MHz clock frequency. Ideal for digital signal processing applications requiring high-speed computation in a compact package. Features low power mode and barrel shifter for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,298 parts In-Stock

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Digiode

USA . 2,445 parts In-Stock

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2,445

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Distributors (Availability)

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One Stop Electronics

USA . 827 parts In-Stock

1+ parts

$7.000

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827

$7.000

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AZTECH Wire

Italy . 639 parts In-Stock

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$11.403

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639

$11.403

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Corohmni

South Africa . 60 parts In-Stock

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$45.513

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60

$45.513

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Parana Technologies

USA . 463 parts In-Stock

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$65.113

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463

$65.113

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DigiPath Technology Company

USA . 1,839 parts In-Stock

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$71.698

100+ parts

$65.962

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1,839

$71.698

$65.962

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ChromeModa Solutions

Germany . 2,982 parts In-Stock

1+ parts

$73.161

100+ parts

$59.992

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2,982

$73.161

$59.992

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IDEA Electronic Components Group

UK . 1,050 parts In-Stock

1+ parts

$73.161

100+ parts

$69.503

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$65.845

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1,050

$73.161

$69.503

$65.845

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Corphita

USA . 4,233 parts In-Stock

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Microchip USA

USA . 405 parts In-Stock

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Assy Fe

Spain . 10 parts In-Stock

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Overview

Unlock the power of advanced digital signal processing with the TMS320C44GFW50 by Texas Instruments. Crafted with precision and expertise, this DSP offers unparalleled performance and reliability for a wide range of applications. From audio processing to telecommunications, this product delivers exceptional value by combining cutting-edge technology with seamless integration. Experience the benefits of high-speed processing, low power consumption, and versatile functionality in a compact and efficient package. Trust Texas Instruments to elevate your projects to new heights with the TMS320C44GFW50.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for portable applications.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for a wide range of power supply options and flexibility in designing power circuits.

Bit Size: 32

With a 32-bit architecture, the product can handle complex digital signal processing tasks efficiently and with high precision.

RAM Words: 8192

The large RAM capacity of 8192 words enables the product to store and process a significant amount of data simultaneously, enhancing performance.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency of 50 MHz allows for fast signal processing and response times, making the product suitable for high-speed applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C44GFW50 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B388

Length:

35 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

388

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA388,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

2.5 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

850 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

35 mm

Peripheral IC Type:

Trade Compliance

TMS320C44GFW50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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