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TMS320C32PCM60

Texas Instruments

TMS320C32PCM60 by Texas Instruments

TMS320C32PCM60 by Texas Instruments is a 32-bit DSP with 60 MHz clock frequency, 512 RAM words, and 24-bit address bus width. Ideal for digital signal processing applications due to its low power mode, barrel shifter feature, and internal bus architecture.

Median Price

$82.250

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

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DigiKey

USA . 884 parts In-Stock

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Rochester

USA . 385 parts In-Stock

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$82.250

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$73.590

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$69.260

385

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$73.590

$69.260

Distributors (In-Stock)

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Nova Conductors

Japan . 67 parts In-Stock

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$70.860

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Digiode

USA . 3,589 parts In-Stock

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$75.496

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Vyrian

USA . 5,431 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,977 parts In-Stock

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Sternenhof Electronics

Switzerland . 960 parts In-Stock

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J & M Industries LLC

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Global Solutions Electronics Company

USA . 46 parts In-Stock

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LittleDiode

UK . 21 parts In-Stock

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ComSIT Distribution GmbH

Germany . 14 parts In-Stock

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Q Components

USA . 13 parts In-Stock

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Bristol Electronics

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ComSIT USA

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Zilex Electronics Inc.

Canada . 6 parts In-Stock

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Rebound Electronics

UK . 4 parts In-Stock

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Lighthouse Electronics, Inc.

USA . 2 parts In-Stock

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SPM Sales

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Distributors (Availability)

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Ampacity Inc.

Singapore . 593 parts In-Stock

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$67.550

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Semicontronic

India . 406 parts In-Stock

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$67.550

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$65.861

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$65.524

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Parana Technologies

USA . 116 parts In-Stock

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$70.449

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Corohmni

South Africa . 151 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$70.860

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Continental Prestige Electronics

USA . 101 parts In-Stock

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$70.860

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$69.443

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Corphita

USA . 4,989 parts In-Stock

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DigiPath Technology Company

USA . 473 parts In-Stock

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$77.573

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$71.367

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ChromeModa Solutions

Germany . 3,478 parts In-Stock

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$79.156

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$64.908

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IDEA Electronic Components Group

UK . 1,387 parts In-Stock

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$75.198

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$71.240

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A-Z Elektronik GmbH

Germany . 5,510 parts In-Stock

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Microchip USA

USA . 3,771 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Argo Parts USA

USA . 848 parts In-Stock

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Perfect Parts

USA . 71 parts In-Stock

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Overview

Unlock the power of digital signal processing with the TMS320C32PCM60 by Texas Instruments. Designed with cutting-edge technology and high-quality materials, this DSP is perfect for a wide range of applications. Whether you're working on audio processing, telecommunications, or motor control, this product offers unparalleled value, performance, and reliability. Say goodbye to limitations and hello to endless possibilities with the TMS320C32PCM60.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the DSP, making it suitable for various environments.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for flexibility in power source selection.

Bit Size: 32

32-bit architecture provides high processing power and efficiency for complex signal processing tasks.

Maximum Clock Frequency: 60 MHz

High clock frequency enables fast signal processing and real-time operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance and efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C32PCM60 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

28 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

2

No. of External Interrupts:

4

No. of Serial I/Os:

1

No. of Terminals:

144

No. of Timers:

2

On Chip Data RAM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

475 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

TMS320C32PCM60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-616-3422, 5962016163422

NIIN

016163422

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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