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TMS320BC51PQ57

Texas Instruments

TMS320BC51PQ57 by Texas Instruments

TMS320BC51PQ57 by Texas Instruments is a 16-bit DSP with 5V supply, 57.14MHz clock freq, and 2080 RAM words. Ideal for digital signal processing applications requiring high-speed data processing in commercial temperature environments. Features include boundary scan, low power mode, and barrel shifter for efficient operations.

Median Price

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Vyrian

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Microfarads

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Global Solutions Electronics Company

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Florida Circuit

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Rotakorn

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Bristol Electronics

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Lighthouse Electronics, Inc.

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ComSIT Distribution GmbH

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One Stop Electronics

USA . 1,234 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 828 parts In-Stock

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IDEA Electronic Components Group

UK . 322 parts In-Stock

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AZTECH Wire

Italy . 466 parts In-Stock

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Overview

Enhance your digital signal processing capabilities with the TMS320BC51PQ57 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products like this DSP, perfect for applications requiring high performance and efficiency. With its advanced features and reliable performance, the TMS320BC51PQ57 offers unmatched value and benefits to customers looking to optimize their systems. Upgrade your projects today with this cutting-edge device and experience the advantages of superior processing power and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product easy to handle and less prone to damage during handling or transportation.

Surface Mount: YES

Surface mount technology allows for efficient and compact packaging of the DSP, saving space on the circuit board and enabling higher component density.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power supply options and can handle fluctuations in the input voltage without risking damage to the DSP.

Address Bus Width: 16

A wider address bus width allows for larger memory addressing capability, enabling the DSP to process and store more data efficiently.

Package Shape: SQUARE

Square packages are easier to mount and align on the circuit board, providing a more stable and secure fit during soldering and assembly.

Bit Size: 16

A 16-bit architecture allows for efficient processing of digital signals, suitable for a wide range of applications requiring moderate processing power.

Power Supplies (V): 5

Operating at a standard 5V power supply simplifies system design and compatibility with other components, reducing the risk of voltage incompatibility issues.

No. of Terminals: 132

Having a higher number of terminals allows for more connectivity options and interfaces, enhancing the versatility and functionality of the DSP.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures that the DSP can function reliably even with lower power input, making it suitable for a wide range of power supply configurations.

Maximum Operating Temperature: 70 °C

Operating at up to 70°C ensures reliable performance in demanding environmental conditions and prevents overheating during extended operation.

Minimum Operating Temperature: 0 °C

The ability to operate at 0°C allows for use in cold environments or applications where temperature stability is crucial.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and longevity of the DSP.

Terminal Position: QUAD

Quad terminal position allows for stable mounting and secure soldering on the circuit board, reducing the risk of mechanical failure or damage during operation.

Maximum Seated Height: 4.57 mm

Having a low seated height enables the DSP to be compactly integrated into the overall system design, saving space and enabling more efficient layouts.

RAM Words: 2080

A large RAM capacity of 2080 words provides ample storage for temporary data processing, facilitating complex algorithms and tasks without frequent memory access.

Width: 24.13 mm

With a moderate width of 24.13 mm, the DSP can be easily integrated into standard-sized circuit boards or system enclosures, optimizing compatibility and flexibility.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the DSP during production or maintenance, ensuring high quality and reliability of the final product.

External Data Bus Width: 16

An external data bus width of 16 bits enables high-speed data transfer and processing, improving overall performance and efficiency of the DSP in data-intensive applications.

Maximum Clock Frequency: 57.14 MHz

Operating at a maximum clock frequency of 57.14 MHz ensures fast and responsive signal processing, suitable for real-time applications or high-speed data processing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperature for 30 seconds ensures reliable soldering and assembly process, leading to durable and long-lasting connections.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, the DSP can withstand harsh soldering processes without compromising its performance or reliability.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal bus architecture enhances data flow and processing efficiency within the DSP, optimizing performance and reducing latency in signal processing tasks.

Length: 24.13 mm

The compact length of 24.13 mm allows for flexible placement and integration of the DSP within the system design, enabling efficient use of space and resources.

Temperature Grade: COMMERCIAL

Operating at commercial temperature grade ensures reliable performance in standard operating conditions, making the DSP suitable for a wide range of commercial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral IC types expands the functionality and capabilities of the DSP, making it suitable for diverse applications and tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP efficient and reliable in processing digital signals while minimizing power usage.

Terminal Form: GULL WING

Gull-wing terminal form provides secure mounting and reliable soldering connections, ensuring long-term performance and durability of the DSP in various operating conditions.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility and stability with standard power sources, simplifying system design and integration with other components.

Terminal Pitch: 0.635 mm

With a small terminal pitch of 0.635 mm, the DSP can be densely packed on the circuit board, enabling high component density and efficient use of space.

Format: FIXED POINT

Utilizing fixed-point format simplifies arithmetic operations and signal processing tasks, enhancing efficiency and accuracy in numerical calculations within the DSP.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates the level of protection from moisture damage during storage or operation, ensuring long-term reliability and durability of the DSP.

Low Power Mode: YES

Enabling low power mode allows the DSP to conserve energy during idle or low-demand periods, increasing overall energy efficiency and reducing power consumption in the system.

Barrel Shifter: YES

Incorporating a barrel shifter enhances the speed and efficiency of arithmetic and logical operations within the DSP, enabling faster data processing and computational tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320BC51PQ57 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

1K WORDS DATA/PROG RAM

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

57.14 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

24.13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

132

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2080

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

TMS320BC51PQ57 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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