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TM4C129ENCPDTT3

Texas Instruments

TM4C129ENCPDTT3 by Texas Instruments

TM4C129ENCPDTT3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 1048576 ROM words and 256 RAM words. It features 20-Ch 12-Bit ADC channels, 32 DMA channels, and peripherals like BOD, CRC, LCD. Ideal for industrial applications requiring low power mode and connectivity via CAN, Ethernet, I2C.

Median Price

$25.850

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,424 parts In-Stock

1+ parts

$16.955

100+ parts

$14.810

1k+ parts

$10.214

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19,424

$16.955

$14.810

$10.214

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Mouser Electronics

USA . 137 parts In-Stock

1+ parts

$25.850

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$18.200

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$17.100

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137

$25.850

$18.200

$17.100

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DigiKey

USA . 86 parts In-Stock

1+ parts

$25.850

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$18.201

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$17.104

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86

$25.850

$18.201

$17.104

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Distributors (In-Stock)

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Digiode

USA . 4,204 parts In-Stock

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$16.107

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Nova Conductors

Japan . 50 parts In-Stock

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$16.914

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$16.914

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Vyrian

USA . 4,215 parts In-Stock

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4,215

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Chip Stock

USA . 347 parts In-Stock

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347

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Bristol Electronics

USA . 12 parts In-Stock

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12

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Distributors (Availability)

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Parana Technologies

USA . 1,686 parts In-Stock

1+ parts

$13.875

100+ parts

-

1k+ parts

$14.352

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1,686

$13.875

-

$14.352

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Ampacity Inc.

Singapore . 6,481 parts In-Stock

1+ parts

$14.410

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6,481

$14.410

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Semicontronic

India . 6,336 parts In-Stock

1+ parts

$14.410

100+ parts

$14.050

1k+ parts

$13.978

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6,336

$14.410

$14.050

$13.978

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Corphita

USA . 4,693 parts In-Stock

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$15.260

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4,693

$15.260

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DigiPath Technology Company

USA . 1,039 parts In-Stock

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$15.278

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$14.056

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1,039

$15.278

$14.056

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ChromeModa Solutions

Germany . 860 parts In-Stock

1+ parts

$15.590

100+ parts

$12.784

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860

$15.590

$12.784

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IDEA Electronic Components Group

UK . 187 parts In-Stock

1+ parts

$15.590

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$14.810

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$14.031

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187

$15.590

$14.810

$14.031

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Continental Prestige Electronics

USA . 890 parts In-Stock

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$16.914

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$16.576

890

$16.914

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$16.576

Microchip USA

USA . 6,615 parts In-Stock

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$47.610

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6,615

$47.610

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Corohmni

South Africa . 350 parts In-Stock

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$67.987

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350

$67.987

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$71.152

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$67.595

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$67.595

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$71.152

$67.595

$67.595

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QUARKTWIN TECHNOLOGY LTD

USA . 29,425 parts In-Stock

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iodParts Technologies Inc.

India . 5,850 parts In-Stock

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Lixinc

USA . 1,616 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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Lucentia Tech

USA . 900 parts In-Stock

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$0.016

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$0.016

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$0.016

GreenTree Electronics

Israel . 652 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Netroflash

USA . 50 parts In-Stock

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$16.576

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$16.069

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$15.730

50

-

$16.576

$16.069

$15.730

Overview

Unlock the power of innovation with the TM4C129ENCPDTT3 microcontroller by Texas Instruments. As a leader in cutting-edge technology, Texas Instruments delivers top-quality products that set the standard for excellence. Ideal for a wide range of applications, this microcontroller offers unparalleled value, efficiency, and performance. With advanced features like integrated cache, DMA channels, PWM capabilities, and a variety of connectivity options, the TM4C129ENCPDTT3 is designed to meet the demands of today's fast-paced world. Experience the difference with Texas Instruments and revolutionize your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable electronic devices.

Integrated Cache: YES

The integrated cache improves processing speed and efficiency by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for reliable performance even under varying voltage conditions.

On Chip Data RAM Width: 8

The 8-bit data RAM width enhances data processing capabilities and efficiency.

Address Bus Width: 28

The wide 28-bit address bus allows for efficient memory addressing and access, enhancing overall performance.

Package Shape: SQUARE

The square package shape allows for easy mounting and integration into various electronic systems.

Bit Size: 32

The 32-bit architecture provides high computational power and efficiency for complex applications.

No. of Terminals: 128

The large number of terminals provide ample connectivity options for various peripherals and external devices.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Technical Specifications

Microcontrollers TM4C129ENCPDTT3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

90

No. of Serial I/Os:

27

No. of Terminals:

128

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Current:

144.6 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Trade Compliance

TM4C129ENCPDTT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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