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TM4C129EKCPDTI3R

Texas Instruments

TM4C129EKCPDTI3R by Texas Instruments

TM4C129EKCPDTI3R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 20-Ch 12-Bit ADC channels and 32 DMA channels. It features industrial temperature grade, CAN and Ethernet connectivity, and low power mode suitable for various applications in automation, control systems, and IoT devices.

Median Price

$11.693

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 10,993 parts In-Stock

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$11.693

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$10.214

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$7.044

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$11.693

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$7.044

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Distributors (In-Stock)

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Digiode

USA . 308 parts In-Stock

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$11.108

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Nova Conductors

Japan . 300 parts In-Stock

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Vyrian

USA . 6,814 parts In-Stock

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Chip Stock

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Semicontronic

India . 10,912 parts In-Stock

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$9.940

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$9.692

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$9.642

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Ampacity Inc.

Singapore . 10,876 parts In-Stock

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$9.940

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Continental Prestige Electronics

USA . 722 parts In-Stock

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$10.305

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$10.099

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Corphita

USA . 4,752 parts In-Stock

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$10.524

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Aranea Global

USA . 1,000 parts In-Stock

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$11.017

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$10.577

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Parana Technologies

USA . 1,414 parts In-Stock

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$15.739

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$16.101

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DigiPath Technology Company

USA . 1,303 parts In-Stock

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$17.330

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$15.944

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ChromeModa Solutions

Germany . 1,299 parts In-Stock

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$17.684

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$14.501

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$17.684

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IDEA Electronic Components Group

UK . 205 parts In-Stock

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$17.684

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$16.800

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$15.916

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205

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$15.916

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AZTECH Wire

Italy . 57 parts In-Stock

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$21.670

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Microchip USA

USA . 2,147 parts In-Stock

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$26.490

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$26.120

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$25.930

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$25.740

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$25.740

Corohmni

South Africa . 210 parts In-Stock

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Advanced Electronics

New Zealand . 237 parts In-Stock

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$81.225

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$77.164

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Component Stockers USA

USA . 887 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

Germany . 5,822 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Kepictronics

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Futuretech Components

Singapore . 780 parts In-Stock

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Overview

Unlock the power of innovation with the TM4C129EKCPDTI3R microcontroller by Texas Instruments. Renowned for their high-quality products, Texas Instruments offers a versatile solution for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers unmatched performance and reliability. Experience seamless connectivity with CAN, Ethernet, I2C, SPI, UART, USB, and more. With low power modes and a wide range of peripherals, the TM4C129EKCPDTI3R is designed to meet your unique needs. Trust Texas Instruments to elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the microcontroller lightweight and durable, suitable for various applications.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers high performance and efficiency, making the microcontroller suitable for complex computing tasks.

Technology: CMOS

Being based on CMOS technology ensures low power consumption and high noise immunity, contributing to overall reliability of the microcontroller.

Connectivity: CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

The microcontroller provides a wide range of connectivity options, enabling seamless integration with various external devices and networks.

Technical Specifications

Microcontrollers TM4C129EKCPDTI3R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

90

No. of Serial I/Os:

2

No. of Terminals:

128

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Trade Compliance

TM4C129EKCPDTI3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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