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TM4C123GH6PGET7R

Texas Instruments

TM4C123GH6PGET7R by Texas Instruments

TM4C123GH6PGET7R by Texas Instruments is a 32-bit microcontroller with integrated cache and 144 terminals. It has a max clock frequency of 25 MHz and is suitable for industrial applications. It offers connectivity options like CAN, I2C, SSI, UART, and USB.

Median Price

$10.930

Lifecycle Status

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5

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1k+

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Texas Instruments

USA . 3,952 parts In-Stock

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$10.930

100+ parts

$8.910

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$5.940

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3,952

$10.930

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$5.940

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Nova Conductors

Japan . 98 parts In-Stock

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$10.336

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-

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98

$10.336

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Digiode

USA . 3,248 parts In-Stock

1+ parts

$10.384

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3,248

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Chip Stock

USA . 4,290 parts In-Stock

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Vyrian

USA . 1,967 parts In-Stock

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1,967

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Ampacity Inc.

Singapore . 3,796 parts In-Stock

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$9.290

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3,796

$9.290

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AZTECH Wire

Italy . 225 parts In-Stock

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$9.560

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225

$9.560

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Corphita

USA . 3,608 parts In-Stock

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$9.837

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$9.837

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Continental Prestige Electronics

USA . 6,820 parts In-Stock

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$10.336

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$10.129

6,820

$10.336

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$10.129

Netroflash

USA . 2,000 parts In-Stock

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$10.336

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$10.129

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Corohmni

South Africa . 129 parts In-Stock

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$18.592

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129

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Microchip USA

USA . 3,183 parts In-Stock

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$25.320

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$24.960

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$24.780

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$24.600

3,183

$25.320

$24.960

$24.780

$24.600

Parana Technologies

USA . 165 parts In-Stock

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$34.271

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$146.090

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165

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ChromeModa Solutions

Germany . 4,620 parts In-Stock

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$38.507

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$31.576

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4,620

$38.507

$31.576

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IDEA Electronic Components Group

UK . 1,869 parts In-Stock

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$38.507

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$36.582

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$34.656

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Lixinc

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Argo Parts USA

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DigiPath Technology Company

USA . 979 parts In-Stock

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$34.718

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979

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Overview

Experience the power and versatility of the TM4C123GH6PGET7R microcontroller by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and reliability. This microcontroller offers endless possibilities in a wide range of applications. With its integrated cache, surface mount capability, and low power mode, it ensures optimal performance without compromising energy efficiency. Whether you're working on industrial automation, robotics, or consumer electronics, the TM4C123GH6PGET7R provides the value, benefits, and advantages to bring your projects to life. Trust Texas Instruments for the innovation and excellence you deserve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This microcontroller's plastic/epoxy package material ensures durability and protection, making it suitable for various environments.

Integrated Cache: YES

The integrated cache enhances the performance and efficiency of the microcontroller by reducing memory access time, making it advantageous for faster data processing.

Surface Mount: YES

Being surface mountable, this microcontroller offers ease of installation and implementation, making it suitable for compact designs and automated production processes.

Maximum Supply Voltage: 3.63 V

With a high maximum supply voltage, this microcontroller can accommodate various power sources and voltage levels, providing flexibility in different applications.

On Chip Data RAM Width: 8

The on-chip data RAM width of 8 ensures efficient data storage and retrieval, contributing to the microcontroller's overall speed and processing capabilities.

Package Shape: SQUARE

The square package shape of this microcontroller allows for easier integration into PCB designs and offers better utilization of space, making it a convenient choice for compact applications.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle larger amounts of data and perform complex calculations, making it suitable for applications requiring high computational capabilities.

No. of Terminals: 144

With 144 terminals, this microcontroller provides ample connectivity options for various peripherals and allows for robust communication interfaces, enhancing its versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers a compact and space-saving solution while maintaining a high level of reliability, making it ideal for miniaturized applications.

Minimum Supply Voltage: 3.15 V

The low minimum supply voltage requirement enables efficient power management and extends battery life, making this microcontroller suitable for energy-conscious designs.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and maintain reliable performance, enhancing its suitability for industrial applications.

CPU Family: CORTEX-M4F

The CORTEX-M4F CPU family provides advanced processing capabilities, high-performance peripherals, and efficient power consumption, making this microcontroller an excellent choice for demanding applications.

Minimum Operating Temperature: -40 °C

The microcontroller's ability to operate at low temperatures allows it to be used in extreme environments, ensuring reliable performance in various challenging conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers superior corrosion resistance, ensuring reliable and long-lasting connections, making this microcontroller an ideal choice for applications exposed to harsh environments.

ADC Channels: YES

The availability of ADC channels allows for accurate analog-to-digital conversion, making this microcontroller suitable for applications that require precise data acquisition from sensors or external signals.

DMA Channels: YES

With DMA channels, this microcontroller can efficiently transfer data between peripherals and memory without CPU intervention, resulting in improved performance and reduced overhead.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection, reducing the risk of accidental disconnection and ensuring reliable data transmission, making this microcontroller a reliable choice for critical applications.

ROM Words: 262144

With a considerable ROM word size, this microcontroller can store large amounts of program code and data, enabling complex functionalities and substantial software capabilities.

Maximum Seated Height: 1.6 mm

The microcontroller's low maximum seated height allows for a compact design and efficient board space utilization, making it suitable for applications where size constraints are critical.

RAM Words: 32

The generous RAM word capacity of 32 allows for efficient data storage and manipulation during program execution, enabling complex algorithms and multitasking capabilities.

Width: 20 mm

With a compact width of 20 mm, this microcontroller can fit into space-constrained designs, making it suitable for applications where size optimization is crucial.

Data EEPROM Size: 2048

The substantial data EEPROM size of 2048 provides non-volatile storage for important data, ensuring that it is retained even during power cycles, making this microcontroller suitable for data logging and persistent settings.

Boundary Scan: YES

The availability of boundary scan capabilities simplifies and enhances testing, debugging, and fault diagnosis of this microcontroller during development and production phases, leading to improved reliability and ease of troubleshooting.

Peripherals: DMA(32), PWM(16), QEI(2), TIMER(12), WDT(2)

With a wide array of peripherals, including DMA, PWM, QEI, TIMER, and WDT, this microcontroller offers versatile capabilities for various applications, enabling precise control, timing, and event handling.

Maximum Clock Frequency: 25 MHz

With a high maximum clock frequency, this microcontroller can execute instructions and perform tasks at a rapid pace, enhancing overall system performance and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller's ability to withstand prolonged peak reflow temperatures for up to 30 seconds ensures reliable soldering during the assembly process, contributing to the product's overall durability and quality.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature tolerance, this microcontroller can endure the demanding thermal conditions of solder reflow processes, ensuring proper soldering and robust connections.

Length: 20 mm

The microcontroller's compact length of 20 mm allows for efficient board space utilization and easy integration into designs with size limitations, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this microcontroller meets the robustness and reliability requirements of industrial applications, making it a suitable choice for demanding and harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

With a microcontroller and RISC-based architecture, this IC offers efficient instruction execution, reduced power consumption, and improved performance, making it advantageous for various applications.

No. of Timers: 12

The availability of 12 timers in this microcontroller enables precise timing control and event management, supporting scheduling and synchronization tasks, making it ideal for time-critical applications.

RAM Bytes: 32768

The substantial RAM byte capacity of 32768 ensures ample memory space for data storage and manipulation, facilitating complex algorithms and efficient multitasking.

Technology: CMOS

Built on CMOS technology, this microcontroller offers low power consumption, fast switching speeds, and excellent noise immunity, making it suitable for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING

The gull-wing terminal form facilitates reliable soldering and secure connections, ensuring robust signal transmission and reducing the risk of electrical discontinuity, making this microcontroller suitable for high-reliability applications.

Analog To Digital Convertors: 24-Ch 12-Bit

With 24 channels and 12-bit resolution, the analog-to-digital converters in this microcontroller allow accurate conversion of analog signals into digital data, enabling precise measurement and monitoring capabilities.

Maximum Supply Current: 58.7 mA

The microcontroller's maximum supply current of 58.7 mA ensures efficient power usage, allowing for longer battery life and reduced power consumption, making it suitable for energy-conscious designs.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this microcontroller can operate reliably across a wide range of applications and power sources, providing flexibility and compatibility with various systems.

No. of DMA Channels: 32

The availability of 32 DMA channels allows for efficient data transfer between peripherals and memory, reducing CPU load, enhancing system performance, and enabling multitasking capabilities.

No. of Serial I/Os: 21

With 21 serial I/Os, this microcontroller offers flexible connectivity options for various communication interfaces, such as SPI, I2C, UART, and USB, enabling seamless integration with external devices and modules.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog outputs, enabling applications such as motor speed control, LED dimming, and audio modulation, making this microcontroller suitable for projects requiring accurate voltage regulation.

Connectivity: CAN(2), I2C(6), SSI(4), UART(8), USB

With support for multiple connectivity options, including CAN, I2C, SSI, UART, and USB, this microcontroller offers versatility in communication interfaces, facilitating seamless integration with various devices and peripherals.

ROM Programmability: FLASH

The ROM programmability through flash memory allows for flexible software updates and firmware modifications, ensuring future-proofing and adaptability to changing application requirements.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this microcontroller allows for efficient PCB routing and increased pin density, making it ideal for space-constrained designs that require a higher number of I/O connections.

Format: FLOATING POINT

The floating-point format capability enables precise and accurate mathematical calculations involving decimal fractions, making this microcontroller suitable for applications that require high-precision calculations.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this microcontroller exhibits moderate moisture sensitivity, ensuring appropriate handling and storage conditions for optimal performance and reliability.

Speed: 80 rpm

With a speed rating of 80 rpm, this microcontroller is suitable for applications requiring precise control and monitoring of rotational speeds, making it ideal for motor control and robotics applications.

Technical Specifications

Microcontrollers TM4C123GH6PGET7R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

105

No. of Serial I/Os:

21

No. of Terminals:

144

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

58.7 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

CAN(2), I2C(6), SSI(4), UART(8), USB

Peripherals:

DMA(32), PWM(16), QEI(2), TIMER(12), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C123GH6PGET7R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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