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TM4C123FE6PMI7R

Texas Instruments

TM4C123FE6PMI7R by Texas Instruments

TM4C123FE6PMI7R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 131072 ROM words, and 32768 RAM bytes. It features 12 ADC channels, 32 DMA channels, and peripherals like PWM(16) and UART(8). Ideal for industrial applications requiring low power consumption and high-speed processing up to 25 MHz.

Median Price

$8.670

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 950 parts In-Stock

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$8.670

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950

$8.670

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Distributors (In-Stock)

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$7.633

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650

$7.633

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Digiode

USA . 635 parts In-Stock

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$8.236

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635

$8.236

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Vyrian

USA . 3,749 parts In-Stock

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3,749

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Distributors (Availability)

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Semicontronic

India . 790 parts In-Stock

1+ parts

$7.370

100+ parts

$7.186

1k+ parts

$7.149

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790

$7.370

$7.186

$7.149

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Ampacity Inc.

Singapore . 578 parts In-Stock

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$7.370

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578

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Continental Prestige Electronics

USA . 2,198 parts In-Stock

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$7.633

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$7.481

2,198

$7.633

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$7.481

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$7.633

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$7.481

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2,000

$7.633

$7.481

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Corphita

USA . 1,062 parts In-Stock

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$7.803

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AZTECH Wire

Italy . 814 parts In-Stock

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$14.262

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$14.262

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Microchip USA

USA . 3,654 parts In-Stock

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$18.700

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$18.430

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$18.300

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$18.170

3,654

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$18.430

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$18.170

Corohmni

South Africa . 210 parts In-Stock

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$23.412

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210

$23.412

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Parana Technologies

USA . 1,833 parts In-Stock

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$59.226

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DigiPath Technology Company

USA . 1,867 parts In-Stock

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$65.215

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1,867

$65.215

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ChromeModa Solutions

Germany . 6,633 parts In-Stock

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$66.546

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$54.568

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6,633

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IDEA Electronic Components Group

UK . 682 parts In-Stock

1+ parts

$66.546

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$63.219

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$59.891

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682

$66.546

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$59.891

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QUARKTWIN TECHNOLOGY LTD

USA . 20,407 parts In-Stock

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Argo Parts USA

USA . 4,763 parts In-Stock

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Overview

Unlock the power of innovation with the TM4C123FE6PMI7R by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers designed for a wide range of applications. This microcontroller offers integrated cache, low power mode, and a variety of peripherals such as ADC channels and PWM channels. With its high performance and flexibility, the TM4C123FE6PMI7R provides exceptional value and benefits to customers looking to create cutting-edge solutions. Upgrade your projects today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the microcontroller, ensuring a longer lifespan.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.32 V

Allows for efficient power utilization and prevents damage from voltage spikes.

On Chip Data RAM Width: 8

Enhances data processing capabilities and overall performance of the microcontroller.

No. of Terminals: 64

Offers ample connectivity options for interfacing with various external devices and components.

ADC Channels: YES

Enables analog-to-digital conversion for accurate sensing and measurement tasks.

PWM Channels: YES

Facilitates precise control of connected devices through pulse-width modulation signals.

Connectivity: CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Supports a wide range of communication protocols, making it versatile for different applications.

Low Power Mode: YES

Conserves energy consumption during idle or low activity periods, increasing overall energy efficiency.

Technical Specifications

Microcontrollers TM4C123FE6PMI7R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

49

No. of Serial I/Os:

5

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

54.9 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C123FE6PMI7R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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