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TM4C123BH6PGEIR

Texas Instruments

TM4C123BH6PGEIR by Texas Instruments

TM4C123BH6PGEIR by Texas Instruments is a 32-bit microcontroller with 144 terminals, operating at up to 25 MHz. It features 105 I/O lines, ADC and DMA channels, and 32768 bytes of RAM. Ideal for industrial applications requiring high-speed processing and precise control with a max supply voltage of 3.63 V.

Median Price

$8.525

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,450 parts In-Stock

1+ parts

$8.525

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$6.950

1k+ parts

$4.633

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10,450

$8.525

$6.950

$4.633

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Distributors (In-Stock)

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Digiode

USA . 2,464 parts In-Stock

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$8.099

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2,464

$8.099

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Nova Conductors

Japan . 500 parts In-Stock

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$8.610

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500

$8.610

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Vyrian

USA . 6,743 parts In-Stock

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Chip Stock

USA . 5,210 parts In-Stock

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Microchip USA

USA . 1,600 parts In-Stock

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$0.603

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$0.603

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Ampacity Inc.

Singapore . 10,055 parts In-Stock

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$7.250

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$7.250

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Corphita

USA . 2,146 parts In-Stock

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$7.672

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Continental Prestige Electronics

USA . 3,345 parts In-Stock

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$8.610

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$8.438

3,345

$8.610

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Netroflash

USA . 1,000 parts In-Stock

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$8.610

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AZTECH Wire

Italy . 790 parts In-Stock

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$10.370

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$10.370

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Corohmni

South Africa . 141 parts In-Stock

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$43.605

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Parana Technologies

USA . 430 parts In-Stock

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$65.425

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$65.425

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DigiPath Technology Company

USA . 248 parts In-Stock

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$72.041

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$66.278

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248

$72.041

$66.278

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ChromeModa Solutions

Germany . 1,590 parts In-Stock

1+ parts

$73.511

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$60.279

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$73.511

$60.279

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IDEA Electronic Components Group

UK . 614 parts In-Stock

1+ parts

$73.511

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$69.835

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$66.160

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614

$73.511

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$66.160

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Lixinc

USA . 12,814 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,447 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 2,657 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments TM4C123BH6PGEIR microcontroller. Manufactured by a trusted industry leader, this powerful device offers unrivaled performance and reliability. Ideal for a wide range of applications, this microcontroller boasts advanced features such as ADC and DMA channels, PWM capabilities, and a high clock frequency. Whether you're a hobbyist or a professional developer, this versatile product is sure to enhance your projects and streamline your workflow. Experience innovation at your fingertips with the TM4C123BH6PGEIR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for easy integration onto printed circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage of 3.63 V allows for flexibility in the power supply options for the microcontroller.

Package Shape: SQUARE

The square package shape helps in efficient placement of the microcontroller on the PCB, optimizing space utilization.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex operations and calculations efficiently, making it suitable for a wide range of applications.

Power Supplies (V): 1.2, 3.3

Having multiple power supply options (1.2V and 3.3V) gives flexibility in designing power management systems for different components in the application.

No. of Terminals: 144

The high number of terminals provides ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style ensures easy installation and maintenance of the microcontroller, making it a convenient choice for deployment in various systems.

Minimum Supply Voltage: 3.15 V

The minimum supply voltage of 3.15V ensures reliable operation even under low voltage conditions, enhancing the robustness of the microcontroller.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand elevated temperatures, making it suitable for industrial applications where heat dissipation is a concern.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers high performance and efficiency, making the microcontroller capable of handling complex tasks with speed and reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in harsh environmental conditions, making the microcontroller suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and longevity of the microcontroller.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and components, expanding its capabilities for diverse sensing and control applications.

DMA Channels: YES

Having DMA channels enables efficient data transfer and processing, reducing the workload on the CPU and enhancing the overall performance of the microcontroller.

Terminal Position: QUAD

The quad terminal position offers stable and secure connections, reducing the risk of signal degradation or disconnection, making the microcontroller reliable in demanding applications.

ROM Words: 65536

With a large ROM capacity of 65536 words, the microcontroller can store and execute complex code and configurations, making it suitable for handling sophisticated applications.

Width: 20 mm

The compact width of 20mm makes the microcontroller compatible with standard PCB sizes, enabling easy integration into various electronic devices and systems.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz enables fast data processing and response times, enhancing the overall performance of the microcontroller in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during assembly, reducing the risk of damage to the microcontroller.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for secure and stable solder joints during the assembly process, ensuring the long-term durability of the microcontroller.

Length: 20 mm

The compact length of 20mm complements the width dimension, making the microcontroller suitable for space-constrained applications without compromising on performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation across a wide range of temperature fluctuations, making the microcontroller suitable for industrial and rugged environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripheral IC types, this product offers efficient and optimized processing capabilities for diverse applications.

RAM Bytes: 32768

With a generous RAM capacity of 32768 bytes, the microcontroller can efficiently store and access data during operation, enhancing its multitasking and processing capabilities.

Technology: CMOS

The CMOS technology used in this microcontroller ensures low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections on the PCB, enabling efficient signal transfer and reducing the risk of connection failures.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures compatibility with standard power sources and provides stable operation for the microcontroller across various applications.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog signals and devices, making the microcontroller versatile for applications requiring accurate modulation and control.

ROM Programmability: FLASH

The flash ROM programmability offers flexibility in updating firmware and configurations, enabling easy maintenance and customization of the microcontroller for different applications.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5mm, the microcontroller allows for high-density mounting on PCBs, maximizing component placement and enabling compact designs.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the microcontroller has moderate sensitivity to moisture during storage and handling, requiring proper precautions to maintain its reliability.

Speed: 80 rpm

With a speed rating of 80 rpm, this microcontroller offers fast data processing and response times, ensuring efficient performance in time-critical applications.

No. of I/O Lines: 105

The ample number of I/O lines (105) provides extensive connectivity options for interfacing with external devices, sensors, and peripherals, making the microcontroller versatile for diverse applications.

Technical Specifications

Microcontrollers TM4C123BH6PGEIR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

105

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TM4C123BH6PGEIR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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