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TLV4112TDA2

Texas Instruments

TLV4112TDA2 by Texas Instruments

TLV4112TDA2 by Texas Instruments is a dual operational amplifier with 3500uV max input offset voltage and 2700kHz nominal unity gain bandwidth. Ideal for applications requiring low bias current, it features 68dB CMRR and operates at 2mA max supply current in a compact rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,052 parts In-Stock

1+ parts

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7,052

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Digiode

USA . 2,600 parts In-Stock

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2,600

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 486 parts In-Stock

1+ parts

$6.530

100+ parts

-

1k+ parts

$7.271

10k+ parts

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486

$6.530

-

$7.271

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DigiPath Technology Company

USA . 128 parts In-Stock

1+ parts

$7.190

100+ parts

$6.615

1k+ parts

-

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128

$7.190

$6.615

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ChromeModa Solutions

Germany . 6,708 parts In-Stock

1+ parts

$7.337

100+ parts

$6.016

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-

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6,708

$7.337

$6.016

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IDEA Electronic Components Group

UK . 2,116 parts In-Stock

1+ parts

$7.337

100+ parts

-

1k+ parts

$6.603

10k+ parts

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2,116

$7.337

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$6.603

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One Stop Electronics

USA . 676 parts In-Stock

1+ parts

$9.410

100+ parts

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676

$9.410

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AZTECH Wire

Italy . 817 parts In-Stock

1+ parts

$17.687

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817

$17.687

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Microchip USA

USA . 1,524 parts In-Stock

1+ parts

$24.360

100+ parts

$24.010

1k+ parts

$23.840

10k+ parts

$23.670

1,524

$24.360

$24.010

$23.840

$23.670

Corphita

USA . 4,003 parts In-Stock

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4,003

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Overview

Experience exceptional performance and reliability with the TLV4112TDA2 operational amplifiers from Texas Instruments. Whether you're designing precision instrumentation, industrial control systems, or audio equipment, this versatile component delivers unmatched quality and accuracy. With ultra-low bias current and high common mode rejection ratio, the TLV4112TDA2 ensures optimal signal integrity in any application. Trust Texas Instruments for cutting-edge technology that exceeds your expectations. Choose the TLV4112TDA2 for superior results every time.

Feature Benefit Bullets

Maximum Input Offset Voltage: 3500 uV

Low input offset voltage helps in minimizing errors in the output signal, making this product suitable for precision applications.

Maximum Average Bias Current (IIB): 0.000025 uA

Low bias current ensures minimal power consumption and helps in maintaining accuracy in signal amplification.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and facilitating automated assembly processes.

Nominal Common Mode Reject Ratio: 68 dB

High common mode rejection ratio indicates the ability of the amplifier to reject unwanted noise signals, leading to cleaner output signals.

Nominal Unity Gain Bandwidth: 2700 kHz

High unity gain bandwidth ensures that the amplifier can amplify signals accurately across a wide range of frequencies, making it versatile for various applications.

Maximum Supply Current: 2 mA

Low supply current ensures efficient power usage, making it suitable for battery-operated devices or low-power applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV4112TDA2 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

2.7 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

68 dB

Minimum Common Mode Rejection Ratio (CMRR ):

68 dB

Input Offset Voltage Limit:

3500 uV

Nominal Slew Rate:

1.57 V/us

Peak Bias Current:

25 pA

Maximum Bias Current (IIB) @25 °C:

25 pA

Operational Characteristics

Maximum Supply Current:

2 mA

Physical Characteristics

Length:

0.055 in (1.397 mm)

Width:

0.05 in (1.27 mm)

Total Terminals:

11

Terminal Position:

Upper

Terminal Form:

Surface Mount:

Yes

Standards

JESD-30 Code:

R-XUUC-N11

Packaging and Shipping

Packing Method:

Tube

Package Code:

DIE

Package Shape:

Package Style:

Uncased Chip

Trade Compliance

TLV4112TDA2 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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