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TLV4110CDRG4

Texas Instruments

TLV4110CDRG4 by Texas Instruments

TLV4110CDRG4 by Texas Instruments is an Operational Amplifier with 4000uV Max Input Offset Voltage, 0.55 V/us Min Slew Rate, and 2200 Min Voltage Gain. Ideal for commercial applications requiring low-bias voltage amplification in a compact small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,203 parts In-Stock

1+ parts

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7,203

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Digiode

USA . 4,812 parts In-Stock

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4,812

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,228 parts In-Stock

1+ parts

$1.410

100+ parts

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1,228

$1.410

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Parana Technologies

USA . 281 parts In-Stock

1+ parts

$3.711

100+ parts

-

1k+ parts

$4.212

10k+ parts

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281

$3.711

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$4.212

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ChromeModa Solutions

Germany . 6,791 parts In-Stock

1+ parts

$4.170

100+ parts

$3.419

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6,791

$4.170

$3.419

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IDEA Electronic Components Group

UK . 1,034 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

$3.753

10k+ parts

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1,034

$4.170

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$3.753

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AZTECH Wire

Italy . 725 parts In-Stock

1+ parts

$17.146

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725

$17.146

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Corphita

USA . 2,353 parts In-Stock

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2,353

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DigiPath Technology Company

USA . 757 parts In-Stock

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$3.760

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757

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$3.760

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Overview

Elevate your electronic designs with the TLV4110CDRG4 operational amplifier by Texas Instruments. Known for their high-quality components, Texas Instruments delivers unmatched reliability and performance in the realm of operational amplifiers. Perfect for a wide range of applications, this op amp offers exceptional value, precision, and efficiency to customers looking to optimize their circuits. Whether you're working on audio equipment, control systems, or sensor interfaces, the TLV4110CDRG4 is the ideal choice to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Maximum Input Offset Voltage: 4000 uV

Low input offset voltage ensures high precision and accuracy in signal processing.

Surface Mount: YES

Easy to install and suitable for automated assembly processes.

Power Supplies (V): 3/5

Flexibility in power supply options for different applications.

No. of Terminals: 8

Sufficient number of terminals for connectivity and functionality.

Minimum Slew Rate: 0.55 V/us

Fast slew rate allows for quick response to input signals.

Temperature Grade: COMMERCIAL

Suitable for standard commercial operating temperatures.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for amplifying and processing electronic signals.

Maximum Supply Current: 1.5 mA

Low power consumption for energy-efficient operation.

Technical Specifications

Operational Amplifiers (Op Amps) TLV4110CDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Programmable Power:

No

Performance Specifications

Input Offset Voltage Limit:

4000 uV

Minimum Voltage Gain:

2200

Minimum Slew Rate:

0.55 V/us

Maximum Bias Current (IIB) @25 °C:

50 pA

Operational Characteristics

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

1.5 mA

Physical Characteristics

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV4110CDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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