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TLV320AIC33IRGZTG4

Texas Instruments

TLV320AIC33IRGZTG4 by Texas Instruments

TLV320AIC33IRGZTG4 by Texas Instruments is a consumer IC with power supplies of 1.8V and 3.3V, operating temperature range from -40 to 85°C, and terminal finish of Ni/Pd/Au. It is used in industrial applications requiring a compact chip carrier package with surface mount capability for audio processing circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,315 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,315

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Digiode

USA . 458 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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458

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$0.531

100+ parts

$0.483

1k+ parts

$0.435

10k+ parts

-

20

$0.531

$0.483

$0.435

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Parana Technologies

USA . 2,114 parts In-Stock

1+ parts

$1.752

100+ parts

$162.655

1k+ parts

$1.576

10k+ parts

-

2,114

$1.752

$162.655

$1.576

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DigiPath Technology Company

USA . 2,065 parts In-Stock

1+ parts

$1.929

100+ parts

$1.774

1k+ parts

-

10k+ parts

-

2,065

$1.929

$1.774

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ChromeModa Solutions

Germany . 4,330 parts In-Stock

1+ parts

$1.968

100+ parts

$1.614

1k+ parts

-

10k+ parts

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4,330

$1.968

$1.614

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IDEA Electronic Components Group

UK . 1,616 parts In-Stock

1+ parts

$1.968

100+ parts

-

1k+ parts

$1.771

10k+ parts

-

1,616

$1.968

-

$1.771

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One Stop Electronics

USA . 480 parts In-Stock

1+ parts

$5.800

100+ parts

-

1k+ parts

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10k+ parts

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480

$5.800

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AZTECH Wire

Italy . 251 parts In-Stock

1+ parts

$15.166

100+ parts

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251

$15.166

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Corphita

USA . 4,465 parts In-Stock

1+ parts

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4,465

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Microchip USA

USA . 1,155 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,155

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Speed Components Ltd (Excess)

Israel . 388 parts In-Stock

1+ parts

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100+ parts

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388

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Overview

Looking to upgrade your consumer electronics? Look no further than the TLV320AIC33IRGZTG4 by Texas Instruments! This high-quality IC offers unmatched performance and reliability, making it a top choice for a wide range of applications. With Texas Instrument's reputation for excellence in manufacturing, you can trust that this product will deliver exceptional value and benefits to meet all your needs. Experience the advantages of cutting-edge technology with the TLV320AIC33IRGZTG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring long-term reliability and ease of handling.

Surface Mount: YES

Surface mount capability allows for easy and efficient mounting on printed circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

Square package shape is compact and efficient, making it ideal for applications where space is limited.

Power Supplies (V): 1.8,3.3

Support for power supplies of 1.8V and 3.3V enables compatibility with a wide range of systems and devices.

No. of Terminals: 48

The high number of terminals provides flexibility in connectivity and functionality, allowing for more complex circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Varied package styles offer versatility in application and thermal management, catering to different design requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environments or under heavy load conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of ambient conditions, making the product versatile and adaptable.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring robust connections and long-term reliability.

Terminal Position: QUAD

Quad terminal position offers enhanced stability and connectivity, making the product suitable for demanding applications or environments.

Maximum Seated Height: 1 mm

Low maximum seated height enables compact designs and space-saving integration, making the product ideal for small form factor devices.

Width: 7 mm

The moderate width allows for efficient PCB layout and space utilization, contributing to ease of assembly and system integration.

Minimum Supply Voltage (Vsup): 2.7 V

Support for a low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing flexibility in system design.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for reliable soldering and assembly processes, ensuring consistent quality and performance.

Length: 7 mm

Moderate length facilitates easy handling and integration into various electronic systems, offering flexibility in design and implementation.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making the product suitable for rugged applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and enhances product sustainability, making it a more eco-friendly choice.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact and dense PCB layouts, enabling high-density integration and miniaturization of electronic devices.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate sensitivity to moisture, requiring standard handling procedures but offering reasonable flexibility in storage and assembly.

Maximum Supply Voltage (Vsup): 3.6 V

Support for a high maximum supply voltage ensures compatibility with various power sources and protection against voltage spikes, enhancing robustness and reliability.

Technical Specifications

Other Function Consumer ICs TLV320AIC33IRGZTG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 1.65V TO 1.95V SUPPLY

General IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TLV320AIC33IRGZTG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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