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TLV320AIC33IGVX

Texas Instruments

TLV320AIC33IGVX by Texas Instruments

TLV320AIC33IGVX by Texas Instruments is a consumer IC with 80 terminals in a grid array package. It operates b/w -40 to 85°C, with supply voltage ranging from 2.7V to 3.6V. This IC is suitable for applications requiring fine pitch and low profile designs, such as consumer electronics and audio devices.

Median Price

$6.692

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 949 parts In-Stock

1+ parts

$4.843

100+ parts

$3.948

1k+ parts

$2.632

10k+ parts

-

949

$4.843

$3.948

$2.632

-

Mouser Electronics

USA . 2,880 parts In-Stock

1+ parts

$8.540

100+ parts

$5.450

1k+ parts

$4.740

10k+ parts

$4.200

2,880

$8.540

$5.450

$4.740

$4.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,739 parts In-Stock

1+ parts

$4.601

100+ parts

-

1k+ parts

-

10k+ parts

-

2,739

$4.601

-

-

-

Vyrian

USA . 3,296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,296

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 661 parts In-Stock

1+ parts

$2.154

100+ parts

-

1k+ parts

$2.667

10k+ parts

-

661

$2.154

-

$2.667

-

DigiPath Technology Company

USA . 1,699 parts In-Stock

1+ parts

$2.372

100+ parts

-

1k+ parts

-

10k+ parts

-

1,699

$2.372

-

-

-

ChromeModa Solutions

Germany . 6,502 parts In-Stock

1+ parts

$2.420

100+ parts

$1.984

1k+ parts

-

10k+ parts

-

6,502

$2.420

$1.984

-

-

IDEA Electronic Components Group

UK . 1,007 parts In-Stock

1+ parts

$2.420

100+ parts

-

1k+ parts

$2.178

10k+ parts

-

1,007

$2.420

-

$2.178

-

Ampacity Inc.

Singapore . 835 parts In-Stock

1+ parts

$4.120

100+ parts

-

1k+ parts

-

10k+ parts

-

835

$4.120

-

-

-

Semicontronic

India . 753 parts In-Stock

1+ parts

$4.120

100+ parts

$4.017

1k+ parts

$3.996

10k+ parts

-

753

$4.120

$4.017

$3.996

-

Corphita

USA . 346 parts In-Stock

1+ parts

$4.359

100+ parts

-

1k+ parts

-

10k+ parts

-

346

$4.359

-

-

-

Corohmni

South Africa . 122 parts In-Stock

1+ parts

$4.843

100+ parts

-

1k+ parts

-

10k+ parts

-

122

$4.843

-

-

-

AZTECH Wire

Italy . 236 parts In-Stock

1+ parts

$10.690

100+ parts

-

1k+ parts

-

10k+ parts

-

236

$10.690

-

-

-

Microchip USA

USA . 1,794 parts In-Stock

1+ parts

$32.138

100+ parts

-

1k+ parts

-

10k+ parts

-

1,794

$32.138

-

-

-

Component Stockers USA

USA . 875 parts In-Stock

1+ parts

$69.900

100+ parts

-

1k+ parts

-

10k+ parts

-

875

$69.900

-

-

-

Overview

Enhance your consumer electronics with the top-notch quality of the TLV320AIC33IGVX by Texas Instruments. As a renowned manufacturer in the industry, Texas Instruments delivers exceptional performance and reliability with this consumer circuit chip. Ideal for a wide range of applications, this product offers unparalleled value, benefits, and advantages to customers looking to elevate their devices to the next level. Experience the difference with Texas Instruments and take your products to new heights with the TLV320AIC33IGVX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, suitable for consumer electronic applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost.

Package Shape: SQUARE

Square package shape ensures a compact design, saving space on the PCB.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product is reliable in a variety of environments.

Minimum Operating Temperature: -40 °C

Capable of operating in cold temperatures down to -40°C, making it suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and reliability during assembly.

Width: 5 mm

Compact width of 5mm allows for efficient use of board space.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement of 2.7 V enables operation in energy-efficient devices.

Peak Reflow Temperature °C: 220

High peak reflow temperature of 220°C ensures reliable soldering during assembly.

Terminal Pitch: 0.5 mm

Fine pitch terminal spacing of 0.5 mm allows for high-density mounting and compact PCB design.

Technical Specifications

Other Function Consumer ICs TLV320AIC33IGVX attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 1.65V TO 1.95V SUPPLY

General IC Type:

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

TLV320AIC33IGVX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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