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TLV320AIC32IRHBTG4

Texas Instruments

TLV320AIC32IRHBTG4 by Texas Instruments

TLV320AIC32IRHBTG4 by Texas Instruments is a consumer IC with 32 terminals, operating at -40 to 85°C. It has power supplies of 1.8-3.3V and terminal finish of Ni/Pd/Au. This chip carrier is suitable for industrial applications requiring a low-profile design and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 16,330 parts In-Stock

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Vyrian

USA . 4,747 parts In-Stock

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4,747

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Digiode

USA . 321 parts In-Stock

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321

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NPI Materials, Inc.

USA . 176 parts In-Stock

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176

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Distributors (Availability)

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$1.284

100+ parts

$1.168

1k+ parts

$1.053

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-

50

$1.284

$1.168

$1.053

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Parana Technologies

USA . 251 parts In-Stock

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$2.194

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$2.705

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251

$2.194

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$2.705

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DigiPath Technology Company

USA . 59 parts In-Stock

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$2.416

100+ parts

$2.222

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59

$2.416

$2.222

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ChromeModa Solutions

Germany . 2,129 parts In-Stock

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$2.465

100+ parts

$2.021

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2,129

$2.465

$2.021

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IDEA Electronic Components Group

UK . 500 parts In-Stock

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$2.465

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$2.218

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500

$2.465

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$2.218

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AZTECH Wire

Italy . 723 parts In-Stock

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$9.511

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723

$9.511

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One Stop Electronics

USA . 790 parts In-Stock

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$13.800

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790

$13.800

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Corphita

USA . 2,364 parts In-Stock

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Microchip USA

USA . 1,970 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the TLV320AIC32IRHBTG4. This innovative consumer IC offers exceptional performance and versatility for a wide range of applications. With its advanced features and durable construction, this product is sure to exceed your expectations. Trust in Texas Instruments for cutting-edge technology that delivers value, benefits, and advantages to customers like you. Elevate your projects with the TLV320AIC32IRHBTG4 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and flexibility, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Package Shape: SQUARE

Square package shape offers compatibility with standard board layouts and maximizes space efficiency.

Power Supplies (V): 1.8,3.3

Support for a range of power supplies enables flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 32

High number of terminals allows for versatile connectivity options and functionality within the circuit.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures enables the product to be used in extreme cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Width: 5 mm

Compact width allows for space-saving integration in compact devices or systems.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage ensures efficient power consumption and operation at lower voltage levels.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage offers flexibility and compatibility with various power input sources.

Technical Specifications

Other Function Consumer ICs TLV320AIC32IRHBTG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 1.525V TO 1.95V SUPPLY

General IC Type:

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

TLV320AIC32IRHBTG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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