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TLV320AIC32IRHBR

Texas Instruments

TLV320AIC32IRHBR by Texas Instruments

TLV320AIC32IRHBR by Texas Instruments is a consumer IC with 32 terminals, operating at -40 to 85°C. It has power supplies of 1.8-3.3V and terminal finish of NiPdAu. This chip carrier is suitable for industrial applications requiring a compact form factor and low supply voltage.

Median Price

$5.251

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,626 parts In-Stock

1+ parts

$5.251

100+ parts

$4.281

1k+ parts

$2.854

10k+ parts

-

12,626

$5.251

$4.281

$2.854

-

Mouser Electronics

USA . 235 parts In-Stock

1+ parts

$9.510

100+ parts

$5.900

1k+ parts

$4.540

10k+ parts

$4.380

235

$9.510

$5.900

$4.540

$4.380

Arrow

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.072

12,000

-

-

-

$4.072

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,318 parts In-Stock

1+ parts

$4.988

100+ parts

-

1k+ parts

-

10k+ parts

-

2,318

$4.988

-

-

-

Chip Stock

USA . 16,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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16,330

-

-

-

-

Vyrian

USA . 2,337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,337

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,160 parts In-Stock

1+ parts

$0.737

100+ parts

-

1k+ parts

$1.750

10k+ parts

-

1,160

$0.737

-

$1.750

-

DigiPath Technology Company

USA . 2,306 parts In-Stock

1+ parts

$0.811

100+ parts

-

1k+ parts

-

10k+ parts

-

2,306

$0.811

-

-

-

IDEA Electronic Components Group

UK . 1,392 parts In-Stock

1+ parts

$0.828

100+ parts

-

1k+ parts

$0.745

10k+ parts

-

1,392

$0.828

-

$0.745

-

ChromeModa Solutions

Germany . 850 parts In-Stock

1+ parts

$0.828

100+ parts

$0.679

1k+ parts

-

10k+ parts

-

850

$0.828

$0.679

-

-

Corphita

USA . 2,710 parts In-Stock

1+ parts

$4.726

100+ parts

-

1k+ parts

-

10k+ parts

-

2,710

$4.726

-

-

-

Lixinc

USA . 12,143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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12,143

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-

-

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Kepictronics

USA . 1,964 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,964

-

-

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Perfect Parts

USA . 1,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,089

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,010 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,010

-

-

-

-

Authorized Procurement Solutions

USA . 98 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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98

-

-

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GreenTree Electronics

Israel . 98 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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98

-

-

-

-

Overview

Discover the cutting-edge TLV320AIC32IRHBR by Texas Instruments, a top-tier manufacturer known for its high-quality products. This consumer IC offers unmatched performance and reliability in a compact package, making it ideal for a wide range of applications. With power supplies ranging from 1.8V to 3.3V, this versatile chip provides exceptional value and benefits to customers looking for superior functionality. Upgrade your electronics with the TLV320AIC32IRHBR and experience the advantage of Texas Instrument's innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components of the IC.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Power Supplies (V): 1.8,3.3

Supports multiple power supply options, increasing flexibility in design.

No. of Terminals: 32

Offers a sufficient number of connections for various circuit connections.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides different package options to suit different design requirements.

Maximum Operating Temperature: 85 °C

Ensures stable operation even in high temperature environments.

Minimum Operating Temperature: -40 °C

Allows for operation in cold temperature conditions as well.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers good conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Facilitates easier PCB layout and routing of connections.

Width: 5 mm

Compact size enables space-efficient designs.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial applications with varying temperature conditions.

Terminal Form: NO LEAD

Environmentally friendly option compared to leaded terminals.

Moisture Sensitivity Level (MSL): 2

Indicates the level of protection against moisture, ensuring reliability in humid environments.

Technical Specifications

Other Function Consumer ICs TLV320AIC32IRHBR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 1.525V TO 1.95V SUPPLY

General IC Type:

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TLV320AIC32IRHBR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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