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TLV320AIC3256IYZFT

Texas Instruments

TLV320AIC3256IYZFT by Texas Instruments

CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 42; Package Code: VFBGA; Package Shape: RECTANGULAR;

Median Price

$10.265

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,257 parts In-Stock

1+ parts

$8.370

100+ parts

$6.824

1k+ parts

$4.549

10k+ parts

-

5,257

$8.370

$6.824

$4.549

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$12.160

100+ parts

$8.180

1k+ parts

$6.180

10k+ parts

-

4

$12.160

$8.180

$6.180

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.673

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.673

-

-

-

Digiode

USA . 1,784 parts In-Stock

1+ parts

$7.952

100+ parts

-

1k+ parts

-

10k+ parts

-

1,784

$7.952

-

-

-

Vyrian

USA . 5,287 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,287

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 51 parts In-Stock

1+ parts

$0.214

100+ parts

-

1k+ parts

$1.520

10k+ parts

-

51

$0.214

-

$1.520

-

ChromeModa Solutions

Germany . 6,114 parts In-Stock

1+ parts

$0.241

100+ parts

$0.198

1k+ parts

-

10k+ parts

-

6,114

$0.241

$0.198

-

-

IDEA Electronic Components Group

UK . 1,602 parts In-Stock

1+ parts

$0.241

100+ parts

-

1k+ parts

$0.217

10k+ parts

-

1,602

$0.241

-

$0.217

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$5.930

100+ parts

$5.811

1k+ parts

-

10k+ parts

-

1,000

$5.930

$5.811

-

-

Continental Prestige Electronics

USA . 277 parts In-Stock

1+ parts

$5.930

100+ parts

-

1k+ parts

-

10k+ parts

$5.811

277

$5.930

-

-

$5.811

Ampacity Inc.

Singapore . 2,374 parts In-Stock

1+ parts

$7.110

100+ parts

-

1k+ parts

-

10k+ parts

-

2,374

$7.110

-

-

-

Corphita

USA . 1,628 parts In-Stock

1+ parts

$7.533

100+ parts

-

1k+ parts

-

10k+ parts

-

1,628

$7.533

-

-

-

Argo Parts USA

USA . 2,111 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,111

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

DigiPath Technology Company

USA . 144 parts In-Stock

1+ parts

-

100+ parts

$0.217

1k+ parts

-

10k+ parts

-

144

-

$0.217

-

-

Technical Specifications

Other Function Consumer ICs TLV320AIC3256IYZFT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B42

JESD-609 Code:

e1

Length:

3.75 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA42,6X7,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.25 mm

Trade Compliance

TLV320AIC3256IYZFT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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