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TLV320AIC23IPWG4

Texas Instruments

TLV320AIC23IPWG4 by Texas Instruments

TLV320AIC23IPWG4 by Texas Instruments is a consumer IC with 28 terminals, operating at -40 to 85°C. It has power supplies of 1.5-3.3V and terminal finish of NiPdAu. This IC is used in industrial applications requiring small outline, thin profile packages for audio processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,759 parts In-Stock

1+ parts

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4,759

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Digiode

USA . 1,743 parts In-Stock

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1,743

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Goldney Electronics S.L.

Spain . 170 parts In-Stock

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170

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 762 parts In-Stock

1+ parts

$2.334

100+ parts

-

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$2.834

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762

$2.334

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$2.834

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IDEA Electronic Components Group

UK . 846 parts In-Stock

1+ parts

$2.623

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$2.361

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846

$2.623

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$2.361

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ChromeModa Solutions

Germany . 619 parts In-Stock

1+ parts

$2.623

100+ parts

$2.151

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619

$2.623

$2.151

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One Stop Electronics

USA . 700 parts In-Stock

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$12.800

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700

$12.800

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AZTECH Wire

Italy . 867 parts In-Stock

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$15.087

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867

$15.087

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DigiPath Technology Company

USA . 1,293 parts In-Stock

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$2.365

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1,293

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$2.365

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Microchip USA

USA . 951 parts In-Stock

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951

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Corphita

USA . 461 parts In-Stock

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461

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Overview

Elevate your audio experience with the TLV320AIC23IPWG4 from Texas Instruments. Designed with precision and expertise, this consumer IC offers unparalleled quality and reliability for a wide range of applications. With a compact rectangular package and advanced features, this product delivers exceptional value and benefits to customers seeking top-notch sound performance. Upgrade your audio systems today with the TLV320AIC23IPWG4 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY for the package body material makes the product lightweight and durable, ideal for consumer applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration onto circuit boards, saving space and making the assembly process more efficient.

Power Supplies (V): 1.5,3.3

Support for multiple power supply voltages (1.5V and 3.3V) makes this product versatile and suitable for a variety of consumer electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in cold or harsh conditions without compromising functionality.

Width: 4.4 mm

The compact width of 4.4mm enables space-efficient designs and integration into small form factor devices.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm allows for high-density mounting on PCBs, enabling more functionality in a limited space.

Technical Specifications

Other Function Consumer ICs TLV320AIC23IPWG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 1.42V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TLV320AIC23IPWG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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