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TLV320AIC14KIRHBR

Texas Instruments

TLV320AIC14KIRHBR by Texas Instruments

TLV320AIC14KIRHBR by Texas Instruments is a 32-terminal audio codec in a square chip carrier package. With nickel palladium gold finish, it has a terminal pitch of 0.5mm and can withstand peak reflow temperature of 260°C for up to 30s. Ideal for industrial telecom applications due to its programmable nature and very thin profile design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,860 parts In-Stock

1+ parts

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2,860

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Digiode

USA . 1,496 parts In-Stock

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1,496

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 651 parts In-Stock

1+ parts

$6.998

100+ parts

-

1k+ parts

$7.562

10k+ parts

-

651

$6.998

-

$7.562

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DigiPath Technology Company

USA . 543 parts In-Stock

1+ parts

$7.706

100+ parts

-

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543

$7.706

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ChromeModa Solutions

Germany . 6,566 parts In-Stock

1+ parts

$7.863

100+ parts

$6.448

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6,566

$7.863

$6.448

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IDEA Electronic Components Group

UK . 1,163 parts In-Stock

1+ parts

$7.863

100+ parts

-

1k+ parts

$7.077

10k+ parts

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1,163

$7.863

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$7.077

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AZTECH Wire

Italy . 455 parts In-Stock

1+ parts

$16.323

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455

$16.323

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Semicontronic

India . 148 parts In-Stock

1+ parts

$59.000

100+ parts

$57.525

1k+ parts

$57.230

10k+ parts

-

148

$59.000

$57.525

$57.230

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One Stop Electronics

USA . 885 parts In-Stock

1+ parts

$160.000

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885

$160.000

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Ampacity Inc.

Singapore . 573 parts In-Stock

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$534.000

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573

$534.000

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Corphita

USA . 2,241 parts In-Stock

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2,241

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Corohmni

South Africa . 227 parts In-Stock

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227

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Overview

Enhance your audio experience with the TLV320AIC14KIRHBR by Texas Instruments. Known for its superior quality and precision engineering, Texas Instruments delivers cutting-edge Audio Codecs that cater to a wide range of applications. Whether you're a music enthusiast, a gamer, or a tech-savvy professional, this programmable codec offers unparalleled value, benefits, and advantages. Upgrade your sound system today with the TLV320AIC14KIRHBR and immerse yourself in high-quality audio like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the audio codec, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, making it convenient for manufacturers during production.

Package Shape: SQUARE

Compact and efficient design that saves space on the circuit board.

No. of Terminals: 32

Sufficient number of terminals for connections and functionality in audio applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and optimal electrical conductivity for improved performance.

Maximum Seated Height: 1 mm

Low profile design allows for flexibility in placement and integration within electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Moisture Sensitivity Level (MSL): 2

Designed to withstand moderate levels of moisture exposure, increasing reliability in diverse environments.

Technical Specifications

Audio Codecs TLV320AIC14KIRHBR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TLV320AIC14KIRHBR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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