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TLV2772ID

Texas Instruments

TLV2772ID by Texas Instruments

TLV2772ID by Texas Instruments is a CMOS Operational Amplifier with 2 functions, offering low bias and high slew rate of 4.7 V/us. It has a max supply voltage limit of 7V and operates in automotive-grade temperatures up to 125°C. Ideal for applications requiring precise signal amplification in compact designs.

Median Price

$1.380

Lifecycle Status

EOL

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 49 parts In-Stock

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$0.674

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$0.674

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Rochester

USA . 1,531 parts In-Stock

1+ parts

$1.380

100+ parts

$1.350

1k+ parts

$1.320

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1,531

$1.380

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$1.320

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Chip1Stop

Japan . 49 parts In-Stock

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$2.200

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$2.200

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Verical

USA . 49 parts In-Stock

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Digiode

USA . 4,075 parts In-Stock

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$1.105

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$1.105

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Chip Stock

USA . 24,270 parts In-Stock

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Vyrian

USA . 5,078 parts In-Stock

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DigiKey Marketplace

USA . 431 parts In-Stock

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$2.050

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431

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$2.050

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Semtec, LLC

USA . 24 parts In-Stock

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LWI Electronics Inc

India . 17 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 671 parts In-Stock

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$1.047

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671

$1.047

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Parana Technologies

USA . 1,590 parts In-Stock

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$1.566

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$2.208

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1,590

$1.566

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$2.208

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IDEA Electronic Components Group

UK . 1,915 parts In-Stock

1+ parts

$1.760

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$1.584

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1,915

$1.760

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$1.584

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ChromeModa Solutions

Germany . 24 parts In-Stock

1+ parts

$1.760

100+ parts

$1.443

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24

$1.760

$1.443

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Component Stockers USA

USA . 69 parts In-Stock

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$1.860

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69

$1.860

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Perfect Parts

USA . 6,093 parts In-Stock

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DigiPath Technology Company

USA . 387 parts In-Stock

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$1.587

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Assy Fe

Spain . 7 parts In-Stock

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Overview

Experience superior performance and reliability with the TLV2772ID Operational Amplifier by Texas Instruments. Built with cutting-edge technology and precision engineering, this dual-function amplifier provides unmatched quality and accuracy for a wide range of applications. With a compact package style and low-bias design, this amplifier offers exceptional value and efficiency to customers looking for high-performance solutions. Trust Texas Instruments to deliver excellence in every aspect, from design to functionality, with the TLV2772ID.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, suitable for various applications.

Maximum Input Offset Voltage: 2700 uV

The low maximum input offset voltage ensures accurate signal processing and minimal errors in the output.

Maximum Average Bias Current (IIB): 0.00035 uA

The low maximum average bias current results in low power consumption and improved efficiency of the operational amplifier.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and simplifying production processes.

Nominal Common Mode Reject Ratio: 82 dB

The high common mode reject ratio ensures that noise and interference are minimized, resulting in cleaner output signals.

Nominal Supply Voltage / Vsup (V): 2.7

The nominal supply voltage of 2.7V makes this operational amplifier suitable for low power applications and battery-powered devices.

Minimum Slew Rate: 4.7 V/us

The minimum slew rate of 4.7 V/us indicates the fast response time of the amplifier to input signal changes, making it suitable for high-frequency applications.

Maximum Supply Voltage Limit: 7 V

The maximum supply voltage limit of 7V ensures the safe operation of the amplifier within specified voltage ranges to prevent damage.

Temperature Grade: AUTOMOTIVE

The automotive grade temperature range makes this operational amplifier suitable for automotive applications where temperature fluctuations are common.

Nominal Unity Gain Bandwidth: 4800 kHz

The high unity gain bandwidth allows for efficient amplification of signals without distortion, making it ideal for high-speed signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2772ID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

2.7/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

4.8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

82 dB

Minimum Common Mode Rejection Ratio (CMRR ):

60 dB

Input Offset Voltage Limit:

2700 uV

Minimum Voltage Gain:

13000

Minimum Slew Rate:

4.7 V/us

Nominal Slew Rate:

6 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

350 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

4 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2772ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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