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TLV2543CDBRG4

Texas Instruments

TLV2543CDBRG4 by Texas Instruments

TLV2543CDBRG4 by Texas Instruments is a 12-bit ADC with 11 analog in channels, 0.0244% EL, and 10us max conversion time. Ideal for commercial applications requiring small outline, shrink pitch packages and 0.066 MHz sample rate.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,284 parts In-Stock

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Vyrian

USA . 1,932 parts In-Stock

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Chip Stock

USA . 547 parts In-Stock

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547

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One Stop Electronics

USA . 1,646 parts In-Stock

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$4.000

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$4.000

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AZTECH Wire

Italy . 665 parts In-Stock

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$6.046

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665

$6.046

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Parana Technologies

USA . 22 parts In-Stock

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$16.731

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$1,553.737

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$15.058

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22

$16.731

$1,553.737

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DigiPath Technology Company

USA . 873 parts In-Stock

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$18.423

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873

$18.423

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ChromeModa Solutions

Germany . 2,937 parts In-Stock

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$18.799

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$15.415

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IDEA Electronic Components Group

UK . 642 parts In-Stock

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$18.799

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$17.859

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$16.919

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642

$18.799

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Corphita

USA . 4,306 parts In-Stock

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Microchip USA

USA . 2,148 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the TLV2543CDBRG4 Analog-to-Digital Converter by Texas Instruments, a trusted leader in semiconductor solutions. This innovative product offers 12 bits of accurate conversion, making it ideal for a wide range of applications. From industrial automation to medical devices, this compact device delivers exceptional performance at a competitive price point, ensuring that you get the most value out of your investment. Upgrade your system today with the TLV2543CDBRG4 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various environmental conditions.

No. of Analog In Channels: 11

Having 11 analog in channels allows for flexibility and the ability to process multiple analog signals simultaneously.

Surface Mount: YES

Being surface mountable simplifies the installation process and makes it suitable for compact designs.

No. of Bits: 12

With 12 bits, the ADC provides a high resolution for accurate conversion of analog signals to digital data.

Maximum Linearity Error (EL): 0.0244 %

The low linearity error ensures accurate and precise conversion results.

Power Supplies (V): 3.3

Operating at 3.3V makes it compatible with common power sources and suitable for low power applications.

No. of Terminals: 20

Having 20 terminals allows for easy connectivity and integration into existing circuits.

Minimum Supply Voltage: 3 V

The minimum supply voltage requirement of 3V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the ADC can handle varying temperature conditions without compromising performance.

Technology: CMOS

The CMOS technology used ensures low power consumption and high speed operation, making the ADC efficient and reliable.

Technical Specifications

Analog-to-Digital Converters TLV2543CDBRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

66 kHz

Hold Mode:

Sample

Maximum Conversion Time:

10 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

3.6 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

3 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.283 in (7.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP20,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV2543CDBRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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